Jun 15, 2017 Zurich8:00 AM - 7:00 PM

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You are invited to join us at the COMSOL Day Zurich for a day of multiphysics modeling training, talks by invited speakers, and the opportunity to exchange ideas with other simulation specialists in the COMSOL community. At this COMSOL Day, you are also welcome to present your own poster. Details on submission will be provided upon registration.

View the schedule for minicourse topics and presentation details.

Pricing & Payment Methods

The registration fee for this COMSOL Day event is CHF 50.00 per person. You will receive an invoice after registering for the event. The fee includes admission to all sessions, coffee breaks, networking lunch, and closing apéro.

Registrants are granted free admission when submitting a poster before May 15, 2017.

Please review our course cancellation/return policies. For additional information, please email info@comsol.ch.

Schedule

8:00 AM
Registration
9:15 AM

This introductory demonstration will show you the fundamental workflow of the COMSOL Multiphysics® modeling environment. We will cover all of the key modeling steps, including geometry creation, setting up physics, meshing, solving, and postprocessing.

10:00 AM

Dynamic Simulation of Ultrathin Microchip Processing in a Die Bonder

The assembly of NAND flash memory is one important segment where Besi is active with their Die Bonder DB2100 sD. One of the biggest challenges is the processing of ultrathin microchips down to a thickness of 20 um and lateral size of 5--15 mm. These chips need to be released (peeled) from a carrier tape (wafer tape) and bonded as stacks of identical chips onto organic multilayer substrates. In this presentation, I will show you how we simulate the peeling process in 2D and 3D. The border between the peeled and unpeeled areas underneath the microchip is called the “peel edge”. This edge moves inward with a peel velocity that depends on the acting adhesive peel force.

In an approach to model the dynamics of peeling, the actual peel velocity is defined as a function of the adhesive peel force. The simulation is done in an iterative way. It starts with an initial geometry, which results in a certain amount of peel force at the peel edge. The corresponding peel velocity is then used to generate the model geometry for the next calculation step and so on. Thus, peeling can be visualized as a movie by stringing together static snapshot calculations. Stress levels in the microchip can be derived.

10:30 AM
Coffee Break
10:45 AM
Parallel Minicourses
CFD and Heat Transfer Minicourse

Get a quick overview of using the CFD Module and Heat Transfer Module within the COMSOL® software environment.

Electromagnetics Minicourse

Get a brief overview of the electromagnetic modeling tools of COMSOL Multiphysics® with a focus on the AC/DC Module, RF Module, Wave Optics Module, and Ray Optics Module.

12:15 PM
Break for Lunch
1:30 PM
Invited Speakers
William M. Clark, Worcester Polytechnic Institute

Using COMSOL Simulations in Engineering Education

In the Chemical Engineering Department at Worcester Polytechnic Institute we use COMSOL Multiphysics not only as a modeling tool for research and to teach applied math modeling to advanced students, but also as a convenient tool to help undergraduates learn engineering fundamentals. We use COMSOL to set up and solve momentum, energy, and mass balances and to visualize the velocity, pressure, temperature, and concentration profiles within chemical process equipment to help “bring to life” not only the underlying physics but also the mathematics. Examples in this talk describe simulations that connect theory to experiment in our chemical engineering laboratory, but they can be applied to fundamental courses in fluids, heat transfer, and mass transfer and the approach can be applied to other disciplines in science and engineering.

We use simulations as pre-lab exercises to review fundamentals and prepare for the lab. Students can also use the simulations to help analyze and augment their experimental results. Fluid flow simulations illustrate differences between compressible and incompressible flow, as well as laminar and turbulent flow, and show that friction losses through pipes and fittings measured in the lab can be calculated from fundamental principles. A heat transfer simulation not only correctly predicts outlet temperatures of a heat exchanger, but also shows the velocity and temperature profiles throughout. By solving the problem both with and without lumped parameter approximations, called heat transfer coefficients, students can see how (and why) these approximations depend on operating conditions and how they describe the bulk fluid results but not the details of the process. Other interesting simulations include a PID temperature control process for a jacketed chemical reactor, carbon dioxide removal from an air stream in an absorption process, and heat transfer in beverage bottles.

Assessment of the enhanced learning afforded by these simulations has resulted in the following observations: 1) students will not utilize simulations if they are offered as “optional” learning enhancements only, 2) when required to use simulations together with experiments, students reported satisfaction and a perceived improvement in understanding, but assessment of written and oral lab reports showed that, due to small sample size and confounding factors, there was little difference between control and intervention groups, and 3) when using simulations with narrow scope aimed at illustrating often misunderstood fundamentals of fluid flow and heat transfer, diagnostic tests showed improvement from pre to post simulation use.

Jürgen Weichart, Evatec AG

Simulation Challenges in Temperature Management of Vacuum Process Components

Evatec develops vacuum production tools and coatings on semiconductor, solar cell, optical, and other substrates. Finite element methods have been used at Evatec for many years to support the optimization of process components, such as magnet arrays, mechanical parts, stations for heating and cooling, as well as molecular flow simulations. A process chamber consists of several parts, like the substrate, protecting shields, and a sputter target or another plasma source. Due to the vacuum gaps, there is usually only bad thermal coupling between these parts, mainly by radiation or by intentionally introduced coupling gas, like in the electrostatic clamping of substrates. Real-time temperature measurements under process conditions up to 600°C are not easy to implement, since the processes are exposed to plasma, a high frequency, and a progressive coating. With the help of heat transfer models in the COMSOL Multiphysics® software, transient temperature measurements of the different process components could be explained and expectations for improvements have been deduced.

Donato Rubinetti, University of Applied Sciences and Arts Northwestern Switzerland

COMSOL® for Applied Research and Development — from Model to Prototype

At the Institute of Thermal and Fluid Engineering of the University of Applied Sciences and Arts Northwestern Switzerland, the COMSOL Multiphysics® software has been introduced because of its user-friendly capability to implement custom partial differential equations. In the beginning, a fully operational numerical model for an electrostatic precipitator was developed, which features electrostatics, fluid dynamics, and particle charging phenomena in a coupled way. Based on its practicality, follow-up projects have been acquired, which include:

  1. Corona discharge modeling: As a spin-off of the electrostatic precipitator study, a fully coupled corona discharge model has been developed to meet the requirements of multiphysics models that include ionization processes.
  2. Electrically assisted powder coating: A model that links electrostatics to fluid dynamics. It is used to determine optimization spots on an existing device, which has been redesigned based on the model.
  3. Acoustic streaming: A technology that uses the attenuation of ultrasound to induce fluid motion has been implemented into a multiphysics model, which includes the acoustics and fluid dynamics in a coupled manner. This model poses substantial numerical challenges due to the time-dependent phenomena of the acoustics and stationary conditions of the fluid dynamics.
  4. Pellet burner application: An industry project preview that exemplarily shows the need for multiphysics modeling in favor of innovation.
A. Mauer and D. Enfrun, Kejako SA

Optical Evaluation of a Biomechanical Human Eye Model

The human sight can naturally adapt its distance of focus for far and near objects; this is called the accommodation process and consists of several factors, such as a change of the crystalline lens shape due to a biomechanical effort. In this talk, we present an optomechanical coupling that evaluates the objective state of vision achieved for given loads on a biomechanical model of the eye developed by Kejako SA. Geometrical and stress values corresponding to the state producing the best optical result for far vision were compared to literature and in vivo measurement performed on the same subjects for far-vision stimuli. The comparison shows that the optomechanical coupling enables the confident assessment of the state of vision of a human eye and is useful as a validation tool for biomechanics modeling. For instance, this may be used to evaluate, in future work, the simulation of the incidence of refractive surgeries or to compute a refractive index corresponding to an amplitude of vision.

Lorenzo Bortot, CERN

Simulation of Electrothermal Transients in Superconducting Accelerator Magnets with COMSOL Multiphysics®

Circular accelerators for particle physics require intense magnetic fields to control the trajectories of particle beams. These fields are obtained using electromagnets wound with fully transposed rectangular cables and cooled down to achieve the superconductive state, allowing the conductors to carry extremely high current densities. A quench is a sudden transition from the superconducting to the normal conducting state in which the energy stored in the magnetic field is released as Ohmic losses. Quenches cannot always be avoided and must be considered as a possible operational scenario. Generally, dedicated quench detection and protection systems are in place to avoid overheating the coil. A careful analysis of the ensuing electrothermal transient is of great importance for the design of the quench protection systems and safe magnet operation.

We present a coupled electrothermal 2D model of a superconducting magnet. The model accounts for the nonlinear temperature- and field-dependent material properties and for the induced eddy currents in the superconducting cable, enabling the calculation of quench initiation and propagation. In particular, the eddy currents are implemented by directly relating the magnetic flux change with the induced effective magnetization. This homogenization technique avoids resolving the micrometric filamentary structure of the superconductor, reducing the computational time.

The construction of the magnet cross section is realized, considering the coil is composed of single turns treated as basic bricks over which material properties and physics laws are homogenized. Since a magnet cross section usually involves hundreds of turns, the model is automatically built through an external Java® framework that calls the necessary COMSOL® API functions.

COMSOL Multiphysics and COMSOL are registered trademarks of COMSOL AB. Oracle and Java are registered trademarks of Oracle and/or its affiliates.

3:30 PM
Coffee Break
4:00 PM
Parallel Minicourses
Introduction to the Application Builder and COMSOL Server™

Learn how to convert a model into a custom app using the Application Builder, which is included in the COMSOL Multiphysics® software. You can upload your apps to a COMSOL Server™ installation to access and run the apps from anywhere within your organization.

Structural Mechanics and Acoustics Minicourse

Get a brief overview of using the Structural Mechanics Module and Acoustics Module within the COMSOL® software environment.

5:30 PM
Closing Apéro

COMSOL Day Details

Location

Technopark Zurich
Technoparkstrasse 1
Zurich 8005

COMSOL Speakers

Sven Friedel
COMSOL Multiphysics GmbH
Zoran Vidakovic
COMSOL Multiphysics GmbH
Thierry Luthy
COMSOL Multiphysics GmbH
Andrea Radu
COMSOL Multiphysics GmbH

Invited Speakers

Stefan Behler
Besi Switzerland Stefan Behler received his MS degree in experimental physics from the University of Göttingen (Gemany) in 1990 and his PhD in physics from the University of Basel (Switzerland) in 1994. He was awarded an Alexander von Humboldt fellowship for a two-year research project at the Lawrence Berkeley National Laboratory (U.S.A.). The project was aimed at investigating the surface chemistry of noble metals. In 1996, he joined Besi (formerly ESEC), where he focuses on the process technology of die bonding. He is currently a project manager for ultrathin die applications at Besi Switzerland.
William Clark
Worcester Polytechnic Institute William Clark is an associate professor in the Chemical Engineering Department at Worcester Polytechnic Institute (WPI) in Worcester, Massachusetts. He holds a BS from Clemson University and a PhD from Rice University, both in chemical engineering. He has taught thermodynamics, separation processes, and unit operations laboratory at WPI for 30 years. His current research focuses on using finite element analysis for teaching chemical engineering principles and for analyzing separation processes.
Jürgen Weichart
Evatec AG Juergen Weichart received his diploma in physics in Hamburg in 1986. After he finished his Dr.-Ing at the Institut für Mikrosystemtechnik of the Technical University of Hamburg-Harburg, he spent three years at Plasma Electronics GmbH in Filderstadt. In 1994, he joined Balzers AG in Liechtenstein, later Unaxis and Oerlikon. There, he managed several R&D projects in PVD, etch sources, hardware, and process development as a senior scientist, resulting in more than 25 patent applications. Since 2015, he continues leading the developments within the Solution Design Team for the different product groups at Evatec AG in Truebbach, Switzerland.
Donato Rubinetti
ITFE Donato Rubinetti graduated in mechanical engineering at FHNW in 2014. From 2014 to 2016, he was a full-time research assistant at the Institute of Thermal and Fluid Engineering (ITFE), focusing on CFD and numerical modeling of multiphysics in collaboration with industry partners. Today, he is a part-time research assistant at ITFE and a part-time master's student with specialization in energy engineering. Donato also volunteers for the International Association for the Exchange of Students for Technical Experience, where he is the president of the local committee in Zurich.
David Enfrun
Kejako SA David Enfrun holds an engineer diploma at Arts et Métiers ParisTech and has specific training for the medtech field, since he started working (more than 15 years ago) on the technology side of the medical devices industry. He has been working in small structures in the ophthalmology, aesthetics, and cardiovascular fields. David recently founded Kejako, which approaches the ophthalmology field with an antiaging mindset to treat presbyopia long term and delay the need for reading glasses without compromising the quality of vision, unlike other existing surgical solutions.
Aurélien Maurer
Kejako SA Aurélien Maurer has worked at Kejako SA since its foundation in 2015. He holds a general engineering degree at Arts et Métiers ParisTech and an additional master's degree in bioengineering for neurosciences at ESPCI ParisTech. This academic background on the edge of clinical research and general mechanics led him to develop biomechanical simulations at Kejako from an engineering approach: reviewing all of the available literature with a structural mechanical approach, setting up reverse engineering experiments, automating 3D modeling from *in vivo* imaging to the development of disruptive solutions. He will eventually push the biomechanical simulations from an R&D point of view to a flexible patient-specific customization tool for surgery planning and optimization.
Lorenzo Bortot
CERN Lorenzo Bortot is a research fellow in the Technology Department at CERN. He received his MS in electrical engineering in 2012 from the University of Padova (Italy), providing a dissertation developed at the Graz University of Technology (Austria) on the stochastic optimization of demodulation rings in loudspeakers. His research interests are mainly focused on the use of finite element analysis for multiphysics simulations of transient effects in high-field superconducting accelerator magnets, particularly quench events. These simulations support both the upcoming high-luminosity Large Hadron Collider upgrade and the next-generation accelerator — Future Circular Collider.

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