COMSOL Day: Electronic Devices
See what is possible with multiphysics simulation
Electronic components have been increasingly miniaturized and, as a result, portable electronic devices have become as powerful as mainframe computers were a decade ago. Many of today's portable devices also include a wide range of built-in sensors and actuators. To account for this advanced complexity when developing these devices, using multiphysics modeling that includes the effects of heat transfer, thermal expansion, elastic wave propagation, piezoelectricity, and electromagnetic fields has become increasingly important. The COMSOL Multiphysics® simulation software platform includes dedicated interfaces and multiphysics couplings that account for these phenomena, enabling you to build high-fidelity models of electronic components and devices.
Join us for COMSOL Day: Electronic Devices to learn from keynote talks and technical presentations about the benefits of using multiphysics simulation to study and design electronic components and devices. We will also give an overview of the relevant features in COMSOL Multiphysics® and demonstrate how the software can be used across large development teams.
Modeling and simulation are essential to research and development (R&D) within the ever-changing electronics industry. In particular, multiphysics modeling platforms that are able to describe coupled phenomena, such as couplings between structural mechanics, heat transfer, fluid flow, and electromagnetic fields, are critical for accurate and realistic simulations. Furthermore, the ability for modeling experts to create simulation apps has become important, as it makes it possible for multiphysics modeling to reach more communities of engineers and scientists.
In this session, we will give an overview of the latest trends in modeling electronic devices, using models and apps within COMSOL Multiphysics® as examples. We will also show you how COMSOL® enables larger teams of engineers and scientists to collaborate on models and apps for their R&D projects.
Acoustic Waveguides and MEMS Resonators in Standard CMOS Technologies
RF filters and reference oscillators are quintessential building blocks for RF transceivers that rely on high-quality factor (Q) mechanical resonators. These resonators can achieve Q’s ~100x higher and are 104x smaller when compared to conventional on-chip components. With the proliferation of the internet of things (IoT) and sub-GHz devices in industrial, infrastructure, and domestic applications, there is a great demand for the miniaturization, cost reduction, and integration of such mechanical resonators in complementary metal–oxide semiconductors (CMOS), all while maintaining their Q. In this keynote talk, a new class of truly solid-state, monolithically integrated GHz CMOS-MEMS resonators is presented. These devices rely on acoustic waveguides, built right inside the front-end-of-line layers of standard CMOS processes, with no additional manufacturing steps or postprocessing. The structure and operating principle of these devices will be explored, with a focus on FEM analysis techniques and efficient design strategies.
Modern electronic devices are packed with MEMS actuators and sensors. The COMSOL® software's modeling capabilities have made it an in-demand tool for designing and optimizing MEMS devices.
The latest version of the software, including its dedicated MEMS Module add-on, features ready-made functionality for modeling electromechanics, electrostriction, magnetomechanics, and magnetostriction. In addition, the software includes unique modeling interfaces for multiphysics phenomena that are important for the study of MEMS devices, such as piezoelectric waves, piezoelectricity, electrothermal expansion, and fluid–structure interaction, to mention a few.
In this session, we will introduce the MEMS Module by summarizing its features and demonstrating examples that analyze MEMS sensors and actuators.
The miniaturization of electronic devices often requires the use of piezoelectric transducers and speakers in order to generate sound and ultrasound. There is a wide range of applications, from sonars for the detection of ships and submarines to microspeakers in cell phones.
For many years, COMSOL Multiphysics® has been essential in the modeling and simulation of piezoelectric devices due to its capability to couple electromagnetic fields with structural mechanics and heat transfer. The latest release of the software includes predefined formulations for the modeling of piezoelectricity as well as elastic waves in solids coupled with pressure wave propagation in fluids.
In this session, we will demonstrate the new multiphysics interfaces for piezoelectric waves in the time domain and a full vibroacoustics analysis involving piezoelectric devices.
Tech Lunches are informal sessions where you can interact with COMSOL staff and other attendees. You will be able to discuss any modeling-related topic that you like and have the opportunity to ask COMSOL technology product managers and applications engineers your questions. Join us!
From Simulation to Absolute Precision
In this keynote talk, Ted Cook will share how he has used COMSOL Multiphysics® simulations in pursuit of two precision measurements, including his failed attempts and eventual successes. The first application was in testing Newton’s inverse-square law of gravity at short distances (his graduate thesis work). He will show how he used the COMSOL® software to determine the critical separation distance of two gravitational test masses with micron-measurement accuracy using only capacitance, focusing in particular on how he solved the challenge of meshing drastically varying aspect ratios in the model. For the second application, he will share how he used COMSOL® to design inductive position encoders to achieve micron-level accuracy and will explain how these models required completely rethinking the lessons he thought he had learned from his previous simulation experience. If there is time, he will also share some tips and tricks he has developed to improve the efficiency of his simulation workflow.
The ability to dissipate heat is one of the most important features of modern electronic devices and is usually a limiting factor in the miniaturization of these devices.
COMSOL Multiphysics® includes functionality for heat transfer through conduction, convection, and radiation. Its ability to treat conjugate heat transfer, including laminar and turbulent flow as well as surface-to-surface radiation, has made it one of the major tools for the design and optimization of thermal management systems in electronics. Its unique multiphysics modeling capabilities also enable the study of thermoelectric effects as well as thermal–structural effects, such as thermal expansion. The latest version of the software features ready-made formulations for accurate phase transition, which can be used, for example, for the modeling of heat pipes.
In this session, we will demonstrate how to create models and apps for conjugate heat transfer in electronic devices. We will also give a general overview of the software’s capabilities for multiphysics modeling, including heat transfer as one of the modeled phenomena.
The COMSOL Multiphysics® add-on products include the RF Module, Wave Optics Module, and Ray Optics Module, all of which can be used to design and optimize devices that involve high-frequency electromagnetic fields. The applications of these modules range from the design of optoelectronic waveguides to the reduction of reflection losses in 5G device connectors.
The unique multiphysics modeling capabilities of the COMSOL® software allow for the creation of accurate models that include thermal and structural effects in high-frequency electromagnetics, for example, stress–optical effects in photonic devices and thermal expansion in cavity filters.
Join us in this session to learn more about the COMSOL® software's multiphysics capabilities for modeling integrated antennas, waveguides, filters, connectors, and other high-frequency electromagnetic devices.
Capacitive sensing is used in many applications, including proximity, pressure, displacement, position, and acceleration sensors. COMSOL Multiphysics® is widely used for the design and optimization of technologies that use such sensors, such as touchscreens.
The design of capacitive devices is elevated by models that couple electromagnetic fields, heat transfer, and structural mechanics, i.e., multiphysics models. These models can be used to optimize the response of touchscreens for different designs, uses, conditions, and touches. The unique ability to create simulation apps with the Application Builder enables developers to enhance their workflow by sharing these apps with colleagues and customers to quickly review designs.
Join us for this session to learn more about the multiphysics modeling of capacitive devices. We will give you an overview of the relevant capabilities in COMSOL Multiphysics® and demonstrate how to create models and simulation apps.
Semiconductors are building block in electronic devices. The COMSOL® software is able to describe a variety of devices, including:
- Bipolar transistors
- Metal-semiconductor field-effect transistors (MESFETs)
- Metal-oxide-semiconductor field-effect transistors (MOSFETs)
- Insulated-gate bipolar transistors (IGBTs)
- Schottky diodes
- p–n junctions
The Semiconductor Module, an add-on to COMSOL Multiphysics®, includes a wide range of functionality for modeling semiconductors and analyzing their operation under different conditions. In addition, a ready-made Schrödinger-Poisson Equation interface enables the modeling of quantum-confined systems, such as quantum wells, wires, and dots. COMSOL Multiphysics® also includes unique multiphysics capabilities and add-on products for designing semiconductors and optimizing their manufacturing, such as the Plasma Module and Chemical Reaction Engineering Module.
Join us for this session to learn more about the modeling of semiconductors and the devices that use them.
Vice President of Sales
David Kan is COMSOL's vice president of sales for the southwestern region of the US. He set up the Los Angeles branch office of COMSOL in 2001 and received a PhD in applied mathematics from UCLA in 1999.
Senior Sales Manager, Events
Lauren Sansone is a senior sales manager at COMSOL, Inc. and has been with COMSOL since 2006. She is responsible for the global event marketing of COMSOL Days, the COMSOL Conference, exhibitions, and training.
Lead Application Engineer
Andrew Strikwerda is a lead application engineer at COMSOL specializing in electromagnetics. He received his PhD in physics from Boston University and conducted postgraduate research at the Technical University of Denmark. He was a senior staff scientist at the Johns Hopkins University (JHU) Applied Physics Laboratory and taught in the JHU Whiting School of Engineering.
Vignesh Gurusamy joined COMSOL in 2021 as an applications engineer specializing in low-frequency electromagnetics. He received his PhD in electrical engineering from the University of Texas at Dallas, where he worked on electrical motors and medium-frequency transformers.
Lead Applications Engineer
Jinlan Huang is an applications engineer for vibrations and acoustics and instructs acoustics training courses. She received her PhD from Boston University, Department of Aerospace and Mechanical Engineering, investigating acoustic wave propagation in complex-tissue environments and ultrasound-induced tissue heating and bleeding control. She joined COMSOL in 2011.
Senior Technical Product Manager
Jiyoun Munn is the technical product manager for the RF Module at COMSOL and a senior member of IEEE. He has 2 decades of experience in the RF industry, creating more than 150 antenna and microwave device prototypes and holding patents for antenna interrogation systems. He has an MS in electrical engineering from the University of Michigan.
Nathaniel Davies joined COMSOL in early 2020 as an applications engineer specializing in electromagnetism He studied at Oxford University, completing an undergraduate degree and PhD in condensed matter physics with a research specialism in novel magnetic and superconducting materials.
Senior Applications Engineer
Mranal Jain has been with COMSOL since 2013 and currently leads the applications team in the Los Altos, CA office. He studied microfluidics and electrokinetic transport, while pursuing his PhD in chemical engineering at the University of Alberta, Edmonton.
MEMS Module Product Manager
At COMSOL, Hidayat Kisdarjono is responsible for the MEMS Module. He received his PhD from the Oregon Health and Science University in Portland, Oregon. Prior to joining COMSOL, he developed semiconductor processes for the fabrication of semiconductor, MEMS, and optical devices.
Register for COMSOL Day: Electronic Devices
This event has ended. Visit the event calendar to view upcoming events.