COMSOL Day: Micro- and Nanotechnologies
See what is possible with multiphysics simulation
The physics associated with micro- and nanotechnologies can often be challenging to simulate. Such components and devices are found within electronics, medical devices, automotive sensors, and actuators — and have much to do with the internet of things.
COMSOL Day: Micro- and Nanotechnologies will address these challenges by showcasing examples and applications through a series of invited keynote presentations. COMSOL technical staff will also discuss modeling strategies, features, and benefits within COMSOL Multiphysics® that enable streamlined design processes.
For a global market that is estimated to be worth close to €500B in 2025, adding an edge to your organization through the use of simulation can only be of benefit.
View the schedule below and register for free today.
Simulation tools are indispensable for design and analysis in micro- and nanotechnologies. Multiphysics modeling, in particular, is crucial to understanding micro- and nanotech devices on the component level, since at these small scales, the interaction of physics becomes more pronounced. This session will focus on the current trends in multiphysics for micro- and nanotechnology, and explore ways to empower more engineers through R&D organizations to perform simulation by using multiphysics apps.
Alexandre Reinhardt, CEA Leti
Elastic or acoustic wave resonators are the building blocks of the several tens of bandpass filters that can be found in recent mobile phones. These filters make it possible to manage geographic disparities in the allocation of the radio frequency spectrum; ensure backward compatibility with previous communication standards (2G, 3G, 4G, and now 5G); and ensure the coexistence of multiple applications (Wi-Fi, Bluetooth®, and GPS) while allowing increasingly large amounts of data rates to be transmitted wirelessly. This particular class of MEMS devices relies on elastic waves propagating in piezoelectric materials to form miniaturized mechanical resonant cavities that also exhibit electrical resonances. They exploit either surface acoustic waves propagating at the surface of a substrate or bulk acoustic waves propagating in the thickness of thin piezoelectric films. In both cases, the continuous improvements in operation frequencies, bandwidths, selectivity, miniaturization, and loss reductions call for precisely harnessing the behavior of elastic waves in multimaterial structures with complex micro- to nanoscale geometries. Hence, numerical simulation is an invaluable tool to develop new generations of resonators and filters and decrease time to market.
In this presentation, we will first discuss challenges toward full-wave simulation of such devices: large aspect ratios and/or the repetition over a large number of the same geometrical unit cell. We will also discuss cumulating multiple physical effects: mechanical and electrical, as well as thermal and propagation of radiofrequency signals. We will then introduce some useful simplifications usually adopted by the industry to simulate first-order effects, sufficient to design components with a satisfying accuracy. We will also discuss how numerical simulation can help investigate second-order effects, especially acoustic leakage and quality factor degradations, for the purpose of mitigating losses and avoiding spurious modes. Finally, we will open the discussion to some new trends from the last few years, bridging the gap between extreme simplification of the problem and precise modeling of complete devices or the modeling of nonlinear effects.
Lanny Liang, STMicroelectronics
Characterization of thermal warpage introduced during manufacturing is one of the main tasks for microelectronics packaging, which significantly influences the heat transfer performance in application. Mismatch of the material coefficient of thermal expansion (CTE) values in the material additive processes acts as the root cause of package warpage, which is additionally affected by the material distribution and fixation time. With the Thermomechanical interface and the Activation boundary condition in COMSOL Multiphysics®, the warpage mechanism during multiple thermal processes can be analyzed.
Multiphysics is inherent to micro- and nanodevices. A small deviation in one physical quantity can lead to a major change for another. For example, consider the common phenomena of thermodilatation and microfluid–structure interaction. Sometimes, you want to avoid these interactions; at other times, they can be used advantageously. Moreover, how the multiphysics are computed can be an important question to address. Do you want a fully coupled simulation or would it be better to use sequential or segregated solvers? All of these questions will be addressed in this Tech Café with invited speakers Olga Cueto from CEA Leti and Sébastien Kawka, application manager at COMSOL France.
In modeling of devices on the micro- and nanoscales, capturing thermodilatation phenomena is essential. This is because temperature distributions often lead to hot spots, where thermal warpage can lead to disaster. In these situations, it is crucial to accurately evaluate heat transfer and the way it interacts with structures. In this session, we will see how to implement and solve such a thermomechanical multiphysics model using the COMSOL Multiphysics® environment.
Designs in microtechnologies and nanotechnologies naturally lead to layered structures with high aspect ratios. This makes simulating these designs a challenge, since you must deal with multiple layers of varying thickness, while still including small details. Moreover, generating the mesh must be scaled correctly both to capture the relevant physics and to avoid meshes, which overwhelm computational resources. These issues will be addressed in this Tech Café with our invited speakers Simone Sala from STMicroelectronics and Sébastien Kawka, application manager at COMSOL France.
The Application Builder is included in the COMSOL Multiphysics® software and allows you to transform your models into simulation apps controlled by interfaces appropriate for what is being simulated. This type of tool is unique to COMSOL Multiphysics® and will open up the world of simulation to all engineers, operators of processes, and scientists. This session will demonstrate the use of the Application Builder and how it can fundamentally augment how your organization approaches simulation.
Damien Radisson, Soitec
Advanced microelectronics applications require integration of thin layers of new materials with traditional support templates. The ever-growing demands for the quality of these layers call for monocrystalline layers with very low crystallographic defect densities, which are well below detection limits of traditional characterization techniques such as TEM- or X-ray-based characterization. The situation is accentuated by the use of the active layers with thickness in nanometer scale, which limits electrical or optical characterization such as PL or EBIC. We propose to use a highly anisotropic chemical etch for delineation of extended defects in thin layers. We are using COMSOL Multiphysics® with deformed geometry and automatic remeshing to model the molten KOH etching of thin SiC layers transferred on a SiC substrate by Smart Cut™ technology.
The laws of heat transfer at the nanoscale differ from those at the macroscale. How different are they? How do the equations and numerical methods change? Is it even worth the effort to take the difference into account? Finally, what needs to be done to implement these changes in COMSOL Multiphysics®? All these questions will be addressed in this Tech Café with our invited speakers Pierre-Olivier Chapuis from CETHIL and Nicolas Huc, technology manager for heat transfer at COMSOL.
Micro- and nanotechnologies are a growing market. With large investments being made in both design and manufacturing, return on investment becomes more important. The overall contribution of physics simulation software (whether it be multiscale, multiphysics, or system integration) toward better ROI comes from reducing prototypes and tests at these very small length scales, thereby shortening time to market and increasing performance. As simulation proves its value and starts to spread throughout R&D organizations, the question of deployment for nonspecialists must be addressed. In this panel discussion, we will cover all of these issues with invited panelists from key companies and R&D institutes.
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