Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.

Heat transfer simulation for thin film molding

Please login with a confirmed email address before reporting spam

Hello everyone,

I got a project recently for a heat transfer simulation (conduction mostly) for a molding process. It consist a mold heated by induction, and the part manufactured.

We are interested in the temperature distribution within the parts manufactured, but these parts have a thickness of 2mm, which is extremely thin compared to the mold(in a range of 1m3), here comes the problem: the difference of thickness between the mold is too large.

The geometry of the mold is so complicated so it can't be too much simplified.
And we can't simplified the part as a thermal resistance, it's thermal properties are anisotropic, not a good conductor and we also want to know how the temperature evolves through the thickness

Does anybody have any good suggestions for this simulation? like how to deal with the difference of thickness, or how to mesh them properly?

Thank you
Best regards

0 Replies Last Post 2017年3月9日 GMT-5 05:58
COMSOL Moderator

Hello Zijian Li

Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.

If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.

Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.