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超填充电镀

Application ID: 12343


本例描述电镀过程中的超填充概念。\n\n电镀速率在表面的凹陷部分加速,其中表面催化剂浓度的增长是由移动网格的面积浓度产生。

This model is included as an example in the following products:

电镀模块

The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the 技术规格表 and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.