COMSOL API Based Toolbox for the Mixed-Level Modeling of Squeeze-Film Damping in MEMS: Simulation and Experimental Validation
We present an easy-to-use toolbox for the automated generation of reduced-order mixed-level models for the evaluation of squeeze-film damping in microelectromechanical systems. The toolbox is programmed in JAVA and heavily exploits the functionality provided by the COMSOL API.
The results obtained from mixed-level model simulation performed in COMSOL Multiphysics agree very well with experimental data. A benchmark of the mixed-level model against other state-of-the-art analytic squeeze-film damping models shows that the mixed-level model is the one with the highest accuracy.