COMSOL API Based Toolbox for the Mixed-Level Modeling of Squeeze-Film Damping in MEMS: Simulation and Experimental ValidationM. Niessner, G. Schrag, J. Iannacci, and G. Wachutka
Institute for Physics of Electrotechnology, Munich University of Technology, Munich, Germany
MEMS Research Unit, Fondazione Bruno Kessler, Povo di Trento, Italy
We present an easy-to-use toolbox for the automated generation of reduced-order mixed-level models for the evaluation of squeeze-film damping in microelectromechanical systems. The toolbox is programmed in JAVA and heavily exploits the functionality provided by the COMSOL API.
The results obtained from mixed-level model simulation performed in COMSOL Multiphysics agree very well with experimental data. A benchmark of the mixed-level model against other state-of-the-art analytic squeeze-film damping models shows that the mixed-level model is the one with the highest accuracy.