科技论文和展示

这里您可以找到在全球 COMSOL 年会上所有用户报告的演示文稿。这些演示文稿介绍 COMSOL 用户是如何使用 COMSOL Multiphysics 进行创新性研究和产品设计。研究主题涵盖了包括电气、机械、流体和化工等范围广泛的行业和应用领域。请使用“快速搜索”来查找与您的研究领域相关的演示文稿。

Microstructural Modelling using COMSOL Multiphysics

Z. Huang, and P. Conway
Wolfson School of Mechanical and Manufacturing Engineering
Loughborough University

This paper presents models of microstructures using COMSOL Multiphysics. In particular, solder joints and bumps are investigated and diffusion of species from the substrate to the interface.

Self Heating Effects and Equilibrium Rise Times within Micro Silicon Thermistors Operating Within a Gas Liquid Interface

R.Osborne, and K. Dawkins
University of Birmingham

This paper considers the thermal behaviour of an array of micro-silicon thermistors operating within a liquid/gas interface for fluid level sensing applications. COMSOL Multiphysics has been used to model and simulate the transient multiphysics model and calculate the overall thermal flux, the steady-state condition and time taken to obtain steady thermal balance.

Stabilised Finite Element Modelling of Oldroyd-B Viscoelastic Flows

T.J. Craven, J.M. Rees, and W.B. Zimmerman
University of Sheffield

The Oldroyd-B family of viscoelastic fluids are notoriously difficult to model numerically. Standard Galerkin finite element methods are prone to numerical oscillations, and solutions break down as fluid elasticity increases. The situation can be remedied to a certain degree however through the addition of weak stabilisation terms to the Galerkin formulation. We present a stabilised ...

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