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COMSOL Conference 2014 — Call for Papers

Announcing the 10th annual conference in the following locations:

Cambridge: Sept 17-19 | Boston: Oct 8-10 | Curitiba: Oct 23-24 | Bangalore: Nov 13-14
Shanghai | Beijing | Tokyo | Seoul | Taipei

BURLINGTON, MA (March 6, 2014) ‐ The Program Committee members of the world’s largest conference on multiphysics simulation are delighted to invite engineers and researchers to submit abstracts to this year’s event. Selected papers, posters, and presentations will be featured at the 10th annual COMSOL Conference, an experience that has been bringing the engineering community together for a decade.

The COMSOL Conference attracts more than 2,000 attendees around the globe and provides them with the chance to share their work and showcase the latest innovations in their fields. The conference focuses on advancing cross-discipline and multiphysics simulation by providing conference attendees with a multitude of hands-on minicourses, user presentations, and keynote talks from industry leaders. The conference also provides attendees with the chance to interact with the makers of COMSOL Multiphysics®.

Conference Highlights Include

  • Application-specific minicourse sessions taught by COMSOL specialists covering a wide array of disciplines
  • Keynote talks from industry leaders and prominent researchers
  • An exhibition showcasing products offered by COMSOL Partners
  • The exciting introduction of the newest version of COMSOL Multiphysics
  • The chance to interact with peers and explore the simulation work of engineers

Presenting a poster, paper, or both at the COMSOL Conference is a great opportunity for multiphysics users to achieve widespread recognition within a skilled community of engineers and researchers. “COMSOL users who present at the conference will have their work recognized and shared with more than 165,000 people. Engineers and scientists will have a unique chance to present in front of colleagues who are working through similar problems,” says Jinlan Huang, Program Chair for the Boston conference. “Attendees can really benefit from sharing new simulation techniques and innovative design strategies.”

Papers and posters presented at the conference will be published on the COMSOL website where they reach a worldwide audience of engineers. Explore the contributions to last year’s conference by visiting:

  • AC/DC Electromagnetics
  • Acoustics and Vibrations
  • Batteries, Fuel Cells, and Electrochemical Processes
  • Bioscience and Bioengineering
  • Chemical Reaction Engineering
  • Computational Fluid Dynamics
  • Electromagnetic Heating
  • Geophysics and Geomechanics
  • Heat Transfer and Phase Change
  • MEMS and Nanotechnology
  • Microfluidics
  • Multiphysics
  • Optics, Photonics, and Semiconductors
  • Optimization and Inverse Methods
  • Particle Tracing
  • Piezoelectric Devices
  • Plasma Physics
  • RF and Microwave Engineering
  • Simulation Methods and Teaching
  • Structural Mechanics and Thermal Stresses
  • Transport Phenomena

Call for Papers and Abstract Submission

Abstract submissions will be reviewed by a Program Committee of experts in simulation. This year, the Program Committee comprises an impressive assembly of scientists and researchers from academia and industry.

Visit to submit an abstract of your work and view submission requirements and deadlines. Conference presenters who submit an abstract by the Early Bird Deadline will receive a discounted conference registration fee.


COMSOL provides simulation software for product design and research to technical enterprises, research labs, and universities through 20 offices and a distributor network throughout the world. Its flagship product, COMSOL Multiphysics®, is a software environment for modeling and simulating any physics-based system. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics® simulation with all major technical computing and CAD tools on the CAE market.


COMSOL, COMSOL Multiphysics, Capture the Concept, COMSOL Desktop, and LiveLink are either registered trademarks or trademarks of COMSOL AB. All other trademarks are the property of their respective owners, and COMSOL AB and its subsidiaries and products are not affiliated with, endorsed by, sponsored by, or supported by those trademark owners. For a list of such trademark owners, see .