科技论文和演示页面包括了 COMSOL 全球用户年会上所有的用户演示文稿。这些演示文稿介绍了 COMSOL 用户是如何使用 COMSOL Multiphysics 进行创新性研究和产品设计,研究主题涵盖了包括电气、机械、流体和化工等范围广泛的行业和应用领域。您可以使用“快速搜索”来查找与您研究领域相关的演示文稿。

Design and Stress Analysis of a General Aviation Aircraft Wing

G. Atmeh[1], F. Darwish[1], and Z. Hasan[2]
[1]Jordan University of Science and Technology, Irbid, Jordan
[2]Texas A&M University, College Station, TX, USA

The present study focuses on the design and analysis of a single-engine, propeller-driven general aviation airplane. Initial weight estimation based on ...

Two- and Three-Dimensional Holey Phononic Crystals with Unit Cells of Resonators

Y.F. Wang[1][2], Y.S. Wang[1], L. Wang[2]
[1]Institute of Engineering Mechanics, Beijing Jiaotong University, Beijing, China
[2]Department of Mechanical Engineering, Østfold University College, Halden, Norway

We show in this paper that by careful design of the geometry of the resonators, complete bandgap with relatively low center frequency can be obtained ...

The Virtual Aquarium: Simulations of Fish Swimming

M. Curatolo [1], L. Teresi [2],
[1] Department of Engineering, Università Roma Tre, Roma, Italy
[2] Department of Mathematics and Physics, Università Roma Tre, Roma, Italy

Our goal is to reproduce the key features of carangiform swimming by running 2D simulations which fully exploit the Fluid-Structure Interaction ...

Simulation of a Micro-Scale Out-of-plane Compliant Mechanism - new

E. Rawashdeh[1], A. Arevalo[1], D. Castro[1], I. G. Foulds[2], N. Dechev[3]
[1]Computer, Electrical & Mathematical Sciences & Engineering Division (CEMSE), King Abdullah University of Science & Technology, Thuwal, Saudi Arabia
[2]School of Engineering, Okanagan Campus, The University of BC, Vancouver, BC, Canada
[3]University of Victoria, Victoria, BC, Canada

In this work we present the simulation of a micro-scale large displacement compliant mechanism called the Tsang suspension. It consists of a flat micro ...

High Curvature Bending of Ultra-Thin Chips and Chip-on-Foil Assemblies

D. van den Ende[1]
[1]Holst Centre / TNO, Eindhoven, The Netherlands

Ultra-thin chips of less than 20µm become flexible, allowing integration of silicon IC technology with highly flexible electronics. This combination ...

Small Scale Yielding Model for Fracture Mechanics - new

K. C. Koppenhoefer[1], J. Thomas[1], J. S. Crompton[1]
[1]AltaSim Technologies, LLC., Columbus, OH, USA

Computational tools based on the finite element method have been used extensively to develop solutions for elastic and elastic-plastic fracture ...

Lamb Waves and Dispersion Curves in Plates and It’s Applications in NDE Experiences Using Comsol Multiphysics

P. Gómez, J. P. Fernandez, and P. D. García
Hydro-Geophysics & NDE Modeling Unit
University of Oviedo
Mieres, Spain

In this paper, a model for numerically obtaining lamb wave modes and dispersion curves in plates is presented. It is shown that COMSOL Multiphysics can ...

Fluid-Structure Interaction Analysis of a Peristaltic Pump

N. Elabbasi, J. Bergstrom, and S. Brown
Veryst Engineering, LLC.
Needham, MA

Peristaltic pumping is an inherently nonlinear multiphysics problem where the deformation of the tube and the pumped fluid are strongly coupled. We ...

Study of Capacitance in Electrostatic Comb-Drive Actuators

P. Hanasi [1], B. G. Sheeparamatti [1], V. Abbigeri [1], N. Meti [1],
[1] Visvesvaraya Technological University, Belagavi, Karnataka, India

Capacitor is mainly defined as two conducting plates that can hold the opposite charges on it. These plates can be used either as a sensor or an ...

Two-Dimensional FEM Simulation of Ultrasonic Wave Propagation in Isotropic Solid Media using COMSOL

B. Ghose[1], K. Balasubramaniam[2], C.V. Krishnamurthy[3], and A.S. Rao[1]
[1] High Energy Materials Research Laboratory, Pune, Maharashtra, India
[2] Center for Non Destructive Evaluation, Department of Mechanical Engineering, IIT Madras Chennai, Tamil Nadu, India
[3] Department of Physics, IIT Madras,Chennai, Tamil Nadu, India

Ultrasonic Testing (UT) is one of the important Non-Destructive Evaluation (NDE) technique widely used for characterisation of materials as well as ...

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