This 5-part, self-paced course is an introduction to the workflow in the software and to modeling Joule heating and thermal expansion in COMSOL Multiphysics®. Through comprehensive, step-by-step demonstrations in the COMSOL® software, you will learn how to effectively perform electro-thermo-mechanical analyses. You will also obtain a thorough overview of how to use the software in general. Model files are included in each part of the course, so you can follow along on your own time. Thus, this course is useful for anyone who is just getting started in the software and learning how to use it. The example model built and used during the course simulates the heating of an array of bond wires connecting a chip to a circuit board. The heating leads to thermal expansion and thermally induced stresses. An overview of the topics covered throughout the course are as follows:

Chip with bond wire array, single bond wire, and bond wire model geometry A chip with an array of bond wires (left) of which we break out and study a single bond wire (center) and then use it for the model geometry (right) as we conduct analyses through the course.

Bond wire simulation app
A simulation app developed for the model during the final part of the course, here displaying results for the stress in a single bond wire.

Upon completing the course, you will have a complete understanding of the modeling workflow in the software as well as have confidence in your own operating of the software and in interpreting the results of your simulations.