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1 Replies 3620 Views
Version 4.0a MeshStructural Mechanics
Gilbert Canon posted 1 decade ago reply 1 decade ago by Melissa Rice
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18 Replies 9754 Views
Version 4.1 Low-Frequency ElectromagneticsModeling Tools & DefinitionsParameters, Variables, & Functions
Alex Golberg posted 1 decade ago reply 1 decade ago by Sharanya Arcot Desai
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1 Replies 3241 Views
Version 3.5a RF & Microwave EngineeringModeling Tools & DefinitionsParameters, Variables, & FunctionsStudies & Solvers
Zhe Wang posted 1 decade ago reply 1 decade ago by Shakeeb Bin Hasan
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1 Replies 1179 Views
Chris McCorquodale posted 1 decade ago reply 1 decade ago by Ivar KJELBERG
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0 Replies 1372 Views
Version 3.5a
Edouard Nesvijski posted 1 decade ago
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0 Replies 1788 Views
Version 4.1
Pengxin Zhang posted 1 decade ago
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1 Replies 3488 Views
Version 4.0a Acoustics & VibrationsStructural Mechanics
User COMSOL posted 1 decade ago reply 1 decade ago by Ivar KJELBERG
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0 Replies 2400 Views
Version 4.1 Low-Frequency Electromagnetics
Tonis Hobejogi posted 1 decade ago
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How can i model semiconductor and its packaging in Comsol using CAD and test under electrical, mechnical and thermal aspect.
read0 Replies 1156 ViewsRashedul Karim posted 1 decade ago
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0 Replies 784 Views
Rose posted 1 decade ago
