Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.

Thermal Diffusion Term in Equation of Semiconductor Material Model Node

Please login with a confirmed email address before reporting spam

Hello,

I should preface this question by adding that I am a rather novice user of COMSOL.

In the Semiconductor module, under Semiconductor Material Model, in the Equation drop-down menu, the electron and hole current densities are written as follows:

In both these equations, the first two terms on the right hand side are the familiar drift and diffusion terms, respectively.

But what is the physical origin of the third term on the right hand side of either equation? Clearly it is some sort of thermal diffusion term. However, it's a bit strange given the factor , wherein the natural logarithm of is taken. It is strange because this is not a dimensionless quantity.

My presumption is that these thermal diffusion terms account for thermoelectric effects in semiconductor materials. However, it would be very helpful if someone could explain their origin to me.

Thanks in advance, Ara G.

P.S. I have checked the COMSOL documentation and failed to find any information regarding this question.


0 Replies Last Post 2018年10月3日 GMT-4 15:57
COMSOL Moderator

Hello Ara Ghukasyan

Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.

If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.

Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.