Note: This discussion is about an older version of the COMSOL Multiphysics® software. The information provided may be out of date.

Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.

Simulation of Self folding due to Surface Tension of Solder

Please login with a confirmed email address before reporting spam

Hi Guys,

I am trying to simulate a self assembly process where I have two frames of Nickel joined together by a solder hinge. When this solder melts, due to surface tension forces, the Ni arms lift up. How do I start with this and if anyone has a similar model, could you please share it with me. I would like to know what physicas to use and whether simulationg in 3D will be easy or tough?

0 Replies Last Post 2014年4月29日 GMT-4 16:17
COMSOL Moderator

Hello Avishek Mishra

Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.

If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.

Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.