论文和技术资料

This poster presents an evaluation study of a couple of heat trap designs, analyzing the generation of Joule heating and heat dissipation characteristics. Through parametric simulations of the heat traps varying geometries, it is possible to see the generated temperature difference at a constant current. Simulating a soldering process, the heat traps are tested on time dependent studies to see the maximum temperature reached, which determines if the process is feasible. By comparing these results with the lack of use of heat traps around certain soldering pads, proves the importance of these structures for the design and production of reliable electronic circuit boards.