科技论文和展示

这里您可以找到在全球 COMSOL 年会上所有用户报告的演示文稿。这些演示文稿介绍 COMSOL 用户是如何使用 COMSOL Multiphysics 进行创新性研究和产品设计。研究主题涵盖了包括电气、机械、流体和化工等范围广泛的行业和应用领域。请使用“快速搜索”来查找与您的研究领域相关的演示文稿。

Numerical Simulation of Phonon Dispersion Relations for Phononic Crystals

G. Zhu[1], E.M. Dede[1]
[1]Toyota Research Institute of North America, Ann Arbor, MI, USA

In previous work, a two-dimensional (2D) model was carried out to simulate the phononic band structure of a phononic crystal with square lattice structure, but this model did not account for the out-of-plane phonon dispersions [1]. In fact, for 2D films used for coating materials, it is more interesting to understand their cross-plane properties. In this work, the phonon dispersion relation of 2D ...

Numerical Study of a High Temperature Latent Heat Storage (200-300oC) Using Eutectic Nitrate Salt of Sodium Nitrate and Potassium Nitrate

C.W. Foong, J.E. Hustad, J. Løvseth, and O.J. Nydal
Department of Energy and Process Engineering, Norwegian University of Science and Technology, Trondheim, Norway

In this study, a small scale direct solar thermal energy storage system with secondary reflector is designed and developed. The main advantage of thermal energy storage is that cooking can be carried out during the time when there is little or no sun shine. In addition, no heat transport fluid is needed in this system. A well insulated heat storage should keep the heat for about 24 hours. KNO3 ...

Heat Transfer and Phase Transformation on Matrix Assisted Pulsed Laser Evaporation (MAPLE) of Biocompatible Thin Layers

E. Lacatus[1], G.C. Alecu[1], M.A. Sopronyi[2], A. Tudor[1]
[1]POLITEHNICA University of Bucharest, Bucharest, Romania
[2]INFLPR -National Institute for Laser Plasma and Radiation Physics, Bucharest, Romania

Matrix Assisted Pulsed Laser Evaporation (MAPLE) technique is used for the deposition of high quality biocompatible polymer thin films. During the deposition process the temperature of the laser target should be kept below 193K to assure the proper quality of both evaporation and deposition phases of the process. On a first approach COMSOL Multiphysics® was used to describe and analyze the ...

Food Cooking Process. Numerical Simulation of the Transport Phenomena

B. Bisceglia[1], A. Brasiello[1], R. Pappacena[1], R. Vietri[1]
[1]University of Salerno, Department of Industrial Engineering, Fisciano (SA), Italy

Aim of the study is to determine the influence of some of the most important operating variables, especially humidity and temperature, of drying air on the performance of cooking process of pork meat. The process is simulated using finite elements software COMSOL Multiphysics®. The proposed model considers two geometries: cylindrical and parallelepiped, with fixed physical properties and ...

A Practical Method to Model Complex Three-Dimensional Geometries with Non-Uniform Material Properties Using Image-based Design and COMSOL Multiphysics®

J. Cepeda[1], S. Birla[2], J. Subbiah[2], H. Thippareddi[1]
[1]Department of Food Science & Technology, University of Nebraska, Lincoln, NE, USA
[2]Department of Biological Systems Engineering, University of Nebraska, Lincoln, NE, USA

Geometries with heterogeneous material properties are typically defined as a set of multiple parts, each part representing a different material. However, assembling or defining the individual parts of complex geometries can be difficult. A practical method based on image-based mesh generation, a custom algorithm for labeling materials, and interpolation functions of COMSOL Multiphysics® can be ...

Power Transistor Heat Sink Design Trade-offs

T. Eppes, I. Milanovic, and G. Quarshie
University of Hartford
West Hartford, CT

Power transistors require heat sinks to dissipate thermal energy and keep junction temperatures below the recommended limit. The reliability and longevity of any semiconductor device is inversely proportional to the junction temperature. Hence, a significant increase in reliability and component life can be achieved by a small reduction in operating temperature. A range of heat sink designs ...

Thermal Analysis of Induction Furnace

A. A. Bhat[1], S. Agarwal [1], D. Sujish[1], B. Muralidharan[1], B. P. Reddy[1], G. Padmakumar[1], K. K. Rajan[1]
[1]Indira Gandhi Center for Atomic Research, Kalpakkam, Tamilnadu, India

Induction furnaces are employed for vacuum distillation process to recover heavy metals after electro-refining operation. Induction furnace of suitable heating rate and cooled by passive means are required to be developed for this purpose. It is planned to set up a mock up induction furnace which will simulate the conditions to be realized in actual vacuum distillation furnace for this purpose. ...

3D Simulation of Heat and Moisture Diffusion in Constructions

M. Bianchi Janetti, and F. Ochs
University of Innsbruck
Unit Building Physics
Innsbruck, Austria

The simulation of heat and moisture transfer represents an essential resource in designing energy efficient buildings. In this paper a time-dependent wall model, consisting of several homogeneous domains, with third-type boundary conditions imposed on the surfaces, is implemented in the COMSOL Multiphysics environment. Temperature and moisture content is calculated inside the construction for ...

Heat Transfer Modeling and Analysis of a Rotary Regenerative Air Pre-heater

R. K. Krishna, R. Ramachandran, and P. Srinivasan
Birla Institute of Technology and Science
Pilani
Rajasthan, India

An attempt has been made to sustain the efficiency of an air pre-heater(APH) in the long run. The APH is modeled using COMSOL Multiphysics in 3D and fed with real life conditions. Upon Heat transfer analysis, the temperature profile was found out and from that, the regions undergoing maximum thermal fatigue stress was identified. The plates of the APH to the periphery are subjected to maximum ...

Dimensionless versus Dimensional Analysis in CFD and Heat Transfer

H. Dillon[1], A.F. Emery[1], A. Mescher[1], and R.J. Cochran[2]
[1]University of Washington, Seattle, WA, USA
[2]Applied CHT, Seattle, WA, USA

Students in engineering and science are often exposed early in their studies to non dimensional analysis. When it comes to solving fluid flow/heat transfer problems, many solutions, particularly industrial ones, are based on finite element/finite volume using dimensioned quantities. In order to compare to reference information one would like to use codes like COMSOL Multiphysics to solve non ...

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