科技论文和展示

这里您可以找到在全球 COMSOL 年会上所有用户报告的演示文稿。这些演示文稿介绍 COMSOL 用户是如何使用 COMSOL Multiphysics 进行创新性研究和产品设计。研究主题涵盖了包括电气、机械、流体和化工等范围广泛的行业和应用领域。请使用“快速搜索”来查找与您的研究领域相关的演示文稿。

Advanced Application of an Automated Generative Tool for MEMS Based on COMSOL Multiphysics

F. Bolognini
University of Cambridge
Cambridge, UK

This work presents a different use of COMSOL as an integrated component of a computational tool framework used to automate designs creation. CNS-Burst is a computational synthesis method that has been implemented with the aim of automatically generating solutions to an assigned design task. COMSOL is integrated in the method and used to evaluate the performance of the design solutions found. ...

Simulation of Thermal Sensor for Thermal Control of Satellite Using COMSOL Multiphysics

G. Mangalgiri
BITS Pilani K K BIRLA GOA CAMPUS
Zuarinagar
Goa, India

The actuator comprises of a temperature sensitive composite deflecting beam, a piezoelectric substrate and a field effect transistor. The temperature rise causes an expansion in the composite beam thereby causing it to deflect. The deflecting beam impinges on the piezoelectric crystal and generating voltage. Response curves for the deflection versus temperature for temperature ranges ...

Thermal Simulation of FCBGA Package with Heat Sink

M. R. Naik[1]
[1]Nitte Meenakshi Institute of Technology, Bengaluru, Karnataka, India

In a modern IC design, the capability of predicting the temperature profile is critically important as well as cooling and related thermal problems are the principal challenges. To address these challenges, thermal analysis must be embedded within IC synthesis. This paper presents thermal analysis of the FCBGA chip with a 4mm×4mm×0.3mm silicon die. The silicon die dissipates heat flux of ...

Kinetic Investigation of a Mechanism for Generating Microstructures on Polycrystalline Substrates Using an Electroplating Process

T. Soares[1], H. Mozaffari[2], H. Reinecke[1]
[1]Universität Freiburg, Freiburg im Breisgau, BW, Germany
[2]Hochschule Furtwangen, Tuttlingen, BW, Germany

The purpose of this study is to understand the growth mechanism of copper (Cu) films on a Cu-Zn system substrate with a pre-defined pattern. The pattern was defined by conducting a selective etching process on a two-phase polycrystalline substrate. As a result of this process, there were etched regions correspondent to beta-phase crystals and quasi non-etched regions that belong to alpha-phase ...

Magnetic Ratchet

A. Auge, F. Wittbracht, A. Weddemann, and A. Hütten
Department of Physics, University of Bielefeld, Germany

Transport phenomena in spatially periodic magnetic systems, in particular the directed transport of magnetic beads in a so called magnetic ratchet (Brownian motor) are considered. Simulations are carried out to test and optimize this system, where the Smoluchowski equation with flux terms for the magnetic and gravitational force is used. Furthermore, experiments are carried out to verify the ...

Investigation on MEMS Based Thermal Sensor for Cancer Detection

A. V. Lakshmi[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

This paper presents the design and simulation of a thermal sensor using COMSOL Multiphysics® software for the detection of low body temperature syndrome which can allow the early detection of cancer. This sensor is made of an alloy consisting of two materials with different coefficients of thermal expansion. The main objective of this work is to investigate the structural change in the sensor ...

Electromagnetic Release Process for Flexible Electronics

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a freestanding flexible substrate such as polyimide would distort unacceptably during even minor temperature excursions ...

Finite Element Modeling of the Stress Field in a Cell-Seeded Microchannel

G. Zhu, and Y. Li
Lawrence Technological University, Southfield, MI, USA

Fluids used in biomedical microelectromechanical systems (BioMEMS) devices often exhibit very different flow behavior from those in bulk solutions, which in turn affects the behavior of cells and biomolecules in the device. In this work, we investigate an integrated microfluidic system for living cell culture and assay. The system can be used as a generic platform to study the behavior of ...

Computational Analysis of Evaporation in Tailored Microchannel Evaporators

S. Arslan[1], J. Brown[1]
[1]Lawrence Technological University, Southfield, MI, USA

The rapid increase in power densities of integrated circuits has induced a significant interest in new reliable and high heat flux cooling technologies. The implication of such growth is the increased need for more efficient and more compact cooling mechanisms. Promising research has been conducted in the area of MEMS cooling devices, taking advantage of the increased heat transfer ...

Numerical and Experimental Evaluation for Measurement of a Single Red Blood Cell Deformability Using a Microchannel and Electric Sensors

K. Tatsumi[1]
[1]Kyoto University, Kyoto City, Kyoto, Japan

An electric micro-resistance sensor that can continuously measure the deformability of a single red blood cell (RBC) in a microchannel and a numerical model that can simulate the resistance and capacitance of the cell membrane and cytoplasm are developed and improved. The resistance signal pattern between the electrodes is measured to evaluate the feasibility of the present sensor, using the ...

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