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Nanoscale Structure Design in EM Fields Using COMSOL Multiphysics

J. Yoo[1], H. Soh[2], J. Choi[3], S. Song[4]
[1]Department of Mechanical Engineering, Yonsei University, Korea
[2]Hyundai Motor Co., Korea
[3]Samsung Electronics Co., Ltd., Korea
[4]Mando Co., Korea

Nanoscale structural analysis and design is presented. All the simulations are carried out using a finite element solver and optimization is performed ...

Shape, Convection and Convergence

R. Pryor
Pryor Knowledge Systems, Inc., Bloomfield Hills, MI, USA

COMSOL Multiphysics software, when properly configured, can readily solve modeling problems in the laminar flow regime using the standard Navier-Stokes ...

Resonant Frequency Analysis of Quartz Shear Oscillator

T. Satyanarayana[1], V. Sai Pavan Rajesh[2]
[1]NPMASS Centre, Lakireddy Bali Reddy Autonomous Engineering College, Mylavaram, Andhra Pradesh, India
[2]Lakireddy Bali Reddy Autonomous Engineering College, Mylavaram, Andhra Pradesh, India

The most commonly used type of resonator is the AT-cut, where the quartz blank is in the form of a thin plate cut at an angle to the optic axis of the ...

Expanding Your Materials Horizons

R. Pryor[1]
[1]Pryor Knowledge Systems, Inc. (COMSOL Certified Consultant), Bloomfield Hills, Michigan, USA

Materials and their related properties are intrinsically fundamental to the creation, development and solution of viable exploratory models when using ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, ...

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of ...

Microfluidic Separation System for Magnetic Beads

F. Wittbrach, A. Weddemann, A. Auge, and A. Hütten
Department of Physics, Bielefeld University, Germany

It is possible to control the motion of magnetic beads using a combination of hydrodynamic and electromagnetic forces. In this work, we investigate the ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.

Design of a RF MEMS Switch

B. Mishra, M. P. S. Naidu, J. Raj, and Z. C. Alex
VIT University
Vellore
Tamilnadu, India

This paper presents a novel design of a RF MEMS Switch. The switch is a capacitive type, which is actuated by an electrostatic force. The structure of the switch consists of a CPW (coplanar waveguides) transmission lines and a suspended membrane. The modelling of switch is done using COMSOL software and RF characteristics is found out by using CST software.

Actively Controlled Ionic Current Gating In Nanopores

G. Zhang[1], S. Bearden[1]
[1]Clemson University, Clemson, SC, USA

It is necessary to understand and control nanopore behavior in order to develop biosensors for a variety of applications including DNA sequencing. The ...