Modeling of Silicon Piezoresistive Pressure Sensor: Application to Prevent Some Diabetes Complications
F. Kerrour, A. Beddiaf, M. Benabbas-Marir
MODerNa Laboratory, University Mentouri, Constantine, Algeria
Several analytical solutions describing the mechanical behavior of a silicon micro membrane deflection, perfectly embedded and subjected to a uniform ...
Numerical and Experimental Evaluation for Measurement of a Single Red Blood Cell Deformability Using a Microchannel and Electric Sensors
Kyoto University, Kyoto City, Kyoto, Japan
An electric micro-resistance sensor that can continuously measure the deformability of a single red blood cell (RBC) in a microchannel and a numerical ...
J. Hrdlicka, P. Cervenka, M. Pribyl, and D. Snita
Department of Chemical Engineering, Institute of Chemical Technology Prague, Prague, Czech Republic
In this paper we present results of the mathematical modeling of AC electroosmotic micropumps. Unlike others we use the full dynamic description, ...
Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics
M. Guvench, and J. Crosby
University of Southern Maine, Gorham, Maine, USA
In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of ...
Combined Analytical and Numerical Modeling of a Resonant MEMS Sensor for Viscosity and Mass Density Measurements
S. Cerimovic, R. Beigelbeck, H. Antlinger, J. Schalko, B. Jakoby, and F. Keplinger
Institute of Sensor and Actuator Systems, Vienna University of Technology, Vienna, Austria
Institute for Integrated Sensor Systems, Austrian Academy of Sciences, Wiener Neustadt, Austria
Institute for Microelectronics and Microsensors, Johannes Kepler University Linz, Linz, Austria
A resonant MEMS sensor for viscosity and mass density measurements of liquids was modeled. The device is based on Lorentz-force excitation and features ...
N. Bhalla, S. Li, and D. Chung
Chung Yuan Christian University, Chungli,Taiwan
National Tsing Hua University, Hsinchu, Taiwan
Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.
A. Beerwinkle, R. Singh, and G. Kirikera
Mechanics of Advanced Materials Laboratory, School of Mechanical and Aerospace Engineering, Oklahoma State University, Tulsa, OK
Geophysical Research Company, LLC, (GRC) Tulsa, OK
A three-dimensional finite element model, based on the linear field equations for superimposed small vibrations onto nonlinear thermoelastic stressed ...
W. J. Wu
NTU Nano-Bio MEMS Group
National Taiwan University,
This presentation presented the following: * The building of an FEA model of an electric cell actuator using COMSOL Multiphysics * Validation of this model through the AVID and ESPI measurement systems * The building of an FEA model of an electric loudspeaker using COMSOL Multiphysics * Validation of this model throughan acoustic measurement systems This paper is in Chinese.
H. Schweiger, T. Göstenkors, R. Bau, D. Zielke
Dept. Engineering Sciences and Mathematics, University of Applied Sciences Bielefeld, Bielefeld, Germany
In this paper we want to figure out the development of a capacitive acceleration-sensor system with the FEM-Method. The sensor-system is in the ...
Reliability Enhancement of Bio MEMS based Cantilever Array Sensors for Antigen Detection System using Heterogeneous Modular Redundancy
L. S. Sundharam
Kumaraguru college of Technology, Coimbatore, Tamil nadu, India
The objective of the work is to propose a reliability enhancement model for antigen detection system (ADS) using bio MEMS based cantilever array ...