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High Coupling Factor Piezoelectric Materials for Bending Actuators: Analytical and Finite Elements Modeling Results

I.A. Ivan[1], M. Rakotondrabe[1], and N. Chaillet[1]
[1]FEMTO-ST Institute, University of Franche-Comte, Besançon, France

New giant piezoelectric factor materials such as PMN-PT and PZN-PT were researched during the last decade and are actually becoming commercially ...

Design of a MEMS Resonator for a Centre Frequency Greater than 26.35 MHz and Temperature Coefficient Frequency Less than 0.5 ppm

S.Manikandan[1], R.Radeep krishna[1]
[1]Kalasalingam University, Department of ECE, Srivilliputtur ,Krishnan koil, Tamil Nadu, India

The variability of the design parameters caused by material properties like thermal conductivity is the major challenge in Micro Electromechanical ...

Computational Simulation of Electrohydrodynamic Systems Pertaining to Micro and Nano scale Fluid Flow Phenomenon

M. Seiler[1], and B. Kirby[2]
[1]Department of Engineering Physics, Cornell
University, NY, USA
[2]Department of Mechanical Engineering, Cornell
University, NY, USA

Modeling of 3D AC electro-osmotic pumps is relevant to the creation of portable or implantable lab-on-a-chip devices for mm/s tunable fluid flows attainable with battery scale voltages. In this analysis using COMSOL Multiphysics we investigate the modeling challenges of computationally calculating systems of fluid flow phenomena governed by AC Electroosmosis in the micro and nano scale regimes.

Design and Analysis of MEMS-based direct methanol fuel cell

Z. Yuan
Harbin Institute of Technology, Harbin, China

In this presentation, “Design and Analysis of MEMS-based direct methanol fuel cell,” there are three main model parts, two-dimensional two-phase mass ...

Scaling Effect in Air Gap MOSFET

R.V. Iyer[1], Vinay K.[1], A. R. Kamath[1], A. Goswami[1], A. Sharma[1], A. V. Joshi[1], A. Mishra[1], N. S. Pai[1], S. Chakraborty[1], Rakesh D.[1]
[1]PES Institute of Technology, Bangalore, Karnataka, India

This abstract addresses the effect of scaling in air gap MOSFETs and determination of functional relationship between scaling parameter and ...

COMSOL Multiphysics for the Designs and Applications on Biomicrofluidic Chips

I-Fang Cheng[1]
[1]National Nano Device Laboratories (NDL), National Applied Research Laboratories, Taipei, Taiwan

Some types of rare pathogens can be detected and identified in human blood through a low-cost and label-free method. The On-Chip SESR identification ...

Analog to Digital Microfluidic Converter

R. Dufour [1], C. Wu[1], F. Bendriaa[1], V. Thomy[1], and V. Senez[1]
[1]BioMEMS Group, IEMN, University of Lille Nord de France, Villeneuve d’Ascq, France

This paper presents an Analog to Digital Microfluidic Converter (ADMC) using passive valves and enabling the conversion of a continuous liquid flow into droplets for Electro-Wetting On Dielectric (EWOD) actuation. Valves calibration, geometry characteristics and losses reduction have been optimized using microfluidic application mode of COMSOL Multiphysics®.

Microfluidic Separation System for Magnetic Beads

F. Wittbrach, A. Weddemann, A. Auge, and A. Hütten
Department of Physics, Bielefeld University, Germany

It is possible to control the motion of magnetic beads using a combination of hydrodynamic and electromagnetic forces. In this work, we investigate the ...

Nanoscale Structure Design in EM Fields Using COMSOL Multiphysics

J. Yoo[1], H. Soh[2], J. Choi[3], S. Song[4]
[1]Department of Mechanical Engineering, Yonsei University, Korea
[2]Hyundai Motor Co., Korea
[3]Samsung Electronics Co., Ltd., Korea
[4]Mando Co., Korea

Nanoscale structural analysis and design is presented. All the simulations are carried out using a finite element solver and optimization is performed ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.