科技论文和演示页面包括了 COMSOL 全球用户年会上所有的用户演示文稿。这些演示文稿介绍了 COMSOL 用户是如何使用 COMSOL Multiphysics 进行创新性研究和产品设计,研究主题涵盖了包括电气、机械、流体和化工等范围广泛的行业和应用领域。您可以使用“快速搜索”来查找与您研究领域相关的演示文稿。

Understanding the Magnetic Field Penetration in Mesoscopic Superconductors via COMSOL Multiphysics® Software - new

I. G. de Oliveira[1]
[1]Universidade Federal Rural do Rio de Janeiro, Seropédica, RJ, Brazil

Introduction: One of the main characteristic of the superconductors is its diamagnetic response of applied magnetic fields. The superconductors refuse ...

Multiphysics Process Simulation of the Electromagnetic-Supported Laser Beam Welding

M. Bachmann, V. Avilov, A. Gumenyuk, and M. Rethmeier
BAM Federal Institute for Materials Research and Testing
Berlin, Germany

The article deals with the magnetically-supported high-power full-penetration laser beam welding of aluminum. A stationary simulation was conducted ...

Numerical Study of Laminar Forced Convection Cooling of Circuit Board Mounted Heat Source Array

S. Durgam [1], S. P. Venkateshan [1], T. Sundararajan [1],
[1] Indian Institute of Technology Madras, Chennai, India

This paper deals with the numerical study of optimal distribution of rectangular heat sources populated on a substrate board for electronic cooling. ...

Demonstration of All-Optical NAND Logic Gate Using Photonic Integrated Circuits

J. T. Andrews[1], R. Choubey[1], O P Choudhary[1], N. Malviya[1], A. Patel[1], M. Kumar[1], S. Chouksey[1], J. Solanki[1]
[1]National MEMS Design Center, Department of Applied Physics, Shri G S Institute of Technology & Science, Indore 452003 MP, India

A logic gate performs a certain Boolean logic operation on one or more logical inputs and produces a single logical output. The logic values are ...

Simulation of Wear using LiveLink™ for MATLAB®

D. Sutton[1]
[1]National Centre for Advanced Tribology at Southampton, University of Southampton, Southampton, United Kingdom

An incremental wear model has been developed using COMSOL Multiphysics® with MATLAB® to predict the evolution of component geometry as a result of ...

Finite Element Analysis of Transient Ballistic-Diffusive Heat Transfer in Two-Dimensional Structures - new

S. Hamian[1], T. Yamada[2], M. Faghri[3], K. Park[1]
[1]University of Utah, Salt Lake City, UT, USA
[2]Lund University, Lund, Sweden
[3]University of Rhode Island, Kingston, RI, USA

For the last two centuries, the conventional Fourier heat conduction equation has been used for modeling a diffusive nature of macroscale heat ...

Design of MEMS Based 4-Bit Shift Register

V. B. Math[1], B. G. Sheeparamatti[1], A. C. Katageri[1]
[1]Basaveshwar Engineering College, Bagalkot, Karnataka, India

This paper presents a unique design of MEMS based 4-bit shift register that perform shifting operation same as logic devices that are composed of solid ...

Finite Element Analysis of Ferrofluid Cooling of Heat Generating Devices

T. Strek
Institute of Applied Mechanics, Poznan University of Technology, Poznan, Poland

An external magnetic field imposed on a ferrofluid with a temperature gradient, results in a non-uniform magnetic body force, which leads to a form of ...

复合材料帽型结构件制造的硅橡胶芯模预制调型孔仿真分析

湛利华 [1], 李自强 [1],
[1] 中南大学机电工程学院,长沙,中国

复合材料帽型加筋结构在航空航天领域得到了广泛应用,硅橡胶芯模是实现其共固化成型的关键工装之一。预浸料固化加热过程中硅橡胶的热膨胀需要通过预制调型孔来消除,以保证帽型加筋结构的成型质量。本文通过 COMSOL Multiphysics® 建立了硅橡胶芯模预制调型孔热力耦合有限元分析模型(图 1) ...

A Time Dependent Dielectric Breakdown (TDDB) Model for Field Accelerated Low-K Breakdown Due To Copper Ions

R. Achanta, J. Plawsky, and W. Gill
Department of Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA

We have simulated the copper ion concentration and internal electric field profiles in a dielectric material by solving the transient continuity ...