科技论文和演示页面包括了 COMSOL 全球用户年会上所有的用户演示文稿。这些演示文稿介绍了 COMSOL 用户是如何使用 COMSOL Multiphysics 进行创新性研究和产品设计,研究主题涵盖了包括电气、机械、流体和化工等范围广泛的行业和应用领域。您可以使用“快速搜索”来查找与您研究领域相关的演示文稿。

Time-Domain Model of the Inner Ear to Study Nonlinear Responses

K. Gladine [1], J. Soons [1], J. Dirckx [1]
[1] University of Antwerp, Belgium

The ear doesn’t solely listen but it also speaks. Sounds formed in the inner ear which are measurable in the outer ear are called Otoacoustic emissions (OAEs). Some claim these are produced by the outer hair cells (OHCs), the amplifiers in the inner ear. Our hypothesis is that the OHCs only amplify distortion products (DPs) but do not produce them.

基于PDE接口推导的轴对称目标非轴对称激励的二维求解模型

卢笛 [1],
[1] 上海交通大学,上海,中国

在振动仿真中,网格量永远是考验工程师的重要问题,虽然计算机性能的提高可以解决一部分计算量问题,但这远远不够。一种有效的方式是进行二维计算,COMSOL Multiphysics® 中也有二维轴对称的几何维度,这极大地方便解决轴对称目标问题。但是由于空间维度的限制 ...

超导转变边探测器 (TES) 的电热仿真

吕越 [1],
[1] 中国科学院上海微系统与信息技术研究所

超导转变边沿探测器 (TES) 是一种电压偏置的电热器件,稳态时超导薄膜产生的焦耳热与通过热连接传递到热沉的热量相等。本文利用有限元仿真软件 COMSOL Multiphysics® 对处于热平衡的 TES 进行了电流-热传导仿真。得到稳态时TES器件的温度分布,并计算得到TES器件的关键参数热导 G,同时得到了器件处于稳态时薄膜温度与偏置电压 (V-T) 的关系,这对于器件设计有着极大的帮助。

直流 GIL 内金属微粒对表面电荷积聚影响的 COMSOL 三维仿真研究

倪潇茹 [1], 常帅 [1], 王志远 [1], 王靖瑞 [1], 于万水 [1],
[1] 华北电力大学

以 SF6 或 SF6/N2 混合气体为绝缘介质的 GIL 具有大容量、高可靠性和环境友好等特点,而 GIL 中存在的金属微粒污染问题是提高设备绝缘强度研究中的关键技术难题。在 GIL 中,金属微粒引起的电场畸变会带来一系列绝缘问题,这些问题需要进行深入研究。针对直流 GIL 中金属微粒污染问题 ...

2D Extraction of Open-Circuit Impedances of Three-Phase Transformers

R. Escarela-Perez[1], E.A. Gutierrez-Rodriguez[2], J.C. Olivares-Galvan[1], M.S. Esparza-González, and E. Campero-Littlewood[1]


[1]Departamento de Energia, Universidad Autonoma Metropolitana - Azcapotzalco, Mexico D.F., Mexico
[2]Instituto Tecnologico de Aguscalientes, Aguascalientes, Mexico

This work is concerned with the study of the asymmetrical phenomenon observed in three-phase transformers during the standard short-circuit test. The ...

Thermal Design of Power Electronic Devices and Modules

N. Delmonte[1], M. Bernardoni[1], P. Cova[1], and R. Menozzi[1]
[1]Dipartimento di Ingegneria dell’Informazione, University of Parma, Parma, Italy

This work describes a way to apply 3D Finite Element Analysis (FEA) to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of Degrees Of Freedom (DOF) due to complex geometry of a power module.

Energy Transformation Damping

G.S. Mulder[1]
[1]Leiden, The Netherlands

A model for material damping is presented in terms of internal friction and in terms of a variation of stiffness. In the latter case the idea is that ...

Simulations of Scanning Electrochemical Microscopy Experiments in Pure Negative and Positive Feedback Mode with Ring Microelectrodes

J. Mauzeroll[1], M. Mayoral[1], and D. Fabre[1]
[1]Department of Chemistry, Université du Québec à Montréal, Montreal, Quebec, Canada

Scanning electrochemical microscopy (SECM) is a powerful tool recently developed for studying structures and processes in micrometer and submicrometer ...

Dynamic Observation of Magnetic Particles in Continuous Flow Devices by Tunneling Magnetoresistance Sensors

A. Weddemann[1], A. Auge[1], F. Wittbracht[1], C. Albon[1], and A. Hütten[1]

[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

Dynamic measurement of magnetic particles in continuous flow devices is made very difficult by the limitations imposed by the sensors themselves. Thus, ...

Navier-Stokes Solutions for Flow and Transport in Realistic Porous Media

N. Abdussamie
American Bureau of Shipping, Tripoli, Libya

This paper illustrates how to set up and solve a two-dimensional flow problem having dimensions of 640 x 320 micro-meter using the Navier-Stokes ...