科技论文和演示页面包括了 COMSOL 全球用户年会上所有的用户演示文稿。这些演示文稿介绍了 COMSOL 用户是如何使用 COMSOL Multiphysics 进行创新性研究和产品设计,研究主题涵盖了包括电气、机械、流体和化工等范围广泛的行业和应用领域。您可以使用“快速搜索”来查找与您研究领域相关的演示文稿。

Heat Transfer and Phase Change Simulation in COMSOL Multiphysics® Software

N. Huc [1]
[1] COMSOL France, Grenoble, France

This session is devoted to phase change modeling in heat transfer simulations. The great interest in phase change comes from the outstanding thermal ...

Tunable MEMS Capacitor for RF Applications

H. S. Shriram[1], T. Nimje[1], D. Vakharia[1]
[1]BITS Pilani, Rajasthan, India

Radio Frequency MEMS devices have emerged to overcome the problem of high losses associated with semiconductors at high frequencies. A tunable MEMS ...

Models for Simulation Based Selection of 3D Multilayered Graphene Biosensors

E. Lacatus [1], G. C. Alecu [1], A. Tudor [1],
[1] Politehnica University of Bucharest, București, Romania

At the forefront of a new generation of sensors graphene and graphene composite materials are intensively studied for medical and biosensing ...

Comparison Between Phase Field and ALE Methods to Model the Keyhole Digging During Spot Laser Welding

V. Bruyere[1], C. Touvrey[1], P. Namy[2]
[1]CEA-DAM, Is-sur-Tille, France
[2]SIMTEC, Grenoble, France

Nowadays, spot laser welding is a full-fledged part of industrial manufacturing and is routinely used due to its advantages. It generates very located ...

Heat Transfer Modeling and Analysis of a Rotary Regenerative Air Pre-heater

R. K. Krishna, R. Ramachandran, and P. Srinivasan
Birla Institute of Technology and Science
Pilani
Rajasthan, India

An attempt has been made to sustain the efficiency of an air pre-heater(APH) in the long run. The APH is modeled using COMSOL Multiphysics in 3D and ...

Simulation of PTFE Billet Sintering using COMSOL

A. Roday, and P. Nicosia
Garlock Sealing Technologies
Palmyra, NY

Sintering is an important step in the manufacturing of polytetrafluoroethylene (PTFE) billets. The challenge in heating large billets stems from the ...

High Curvature Bending of Ultra-Thin Chips and Chip-on-Foil Assemblies

D. van den Ende[1]
[1]Holst Centre / TNO, Eindhoven, The Netherlands

Ultra-thin chips of less than 20µm become flexible, allowing integration of silicon IC technology with highly flexible electronics. This combination ...

Study of Stent Deformation and Stress Developed at Different Stent Deployment Pressures

K. Basu[1], P. Ghosh[2], A. Chanda[1]
[1]School of Bio Science and Engineering, Jadavpur University, Kolkata, West Bengal, India
[2]Jadavpur University, Kolkata, West Bengal, India

According to clinical reports, cardiovascular disease has become a major global healthcare problem. The deposition of fats, cholesterol etc. at the ...

Study of Capacitance in Electrostatic Comb-Drive Actuators

P. Hanasi [1], B. G. Sheeparamatti [1], V. Abbigeri [1], N. Meti [1],
[1] Visvesvaraya Technological University, Belagavi, Karnataka, India

Capacitor is mainly defined as two conducting plates that can hold the opposite charges on it. These plates can be used either as a sensor or an ...

Air Damping of Oscillating MEMS Structures: Modeling and Comparison with Experiment

S. Gorelick[1], M. Leivo[1], U. Kantojärvi[1]
[1]VTT Technical Research Centre of Finland, Espoo, Finland

Excessive air damping can be detrimental to the performance of oscillating MEMS components. Complex systems, such as structures in pre-etched cavities ...