COMSOL Simulation Summit: Santa Clara
The Simulation Summit brings together engineers, researchers, and technology leaders to explore how multiphysics simulation is transforming product design, manufacturing, and research. With no cost for entry, this event welcomes both experienced users and engineers new to COMSOL, offering opportunities to exchange ideas, see real-world applications, and learn how simulation supports innovation across industries.
Technical presentations, live demonstrations, and dedicated networking sessions encourage collaboration and discussion throughout the day. Attendees will also gain insight into the latest advancements in COMSOL Multiphysics® — including major performance improvements, new modeling capabilities, and enhancements introduced in version 6.4. Highlights include explicit dynamics for structural analysis of high-speed events such as impacts and blasts, the new Granular Flow Module for studying bulk grain and powder behavior, and GPU acceleration through the NVIDIA CUDA® direct sparse solver (cuDSS) library.
This is a complimentary event, but please register in advance, as seats are limited.
Schedule
COMSOL Multiphysics® is used in various industries and research areas to analyze and design products where multiple physical effects interact. In many application areas, simulation supports faster development by enabling virtual prototyping, performance evaluation, and design exploration before building costly test hardware. Typical use cases include predicting stresses and vibrations in mechanical components, studying coupled thermal–structural behavior, analyzing fluid flow and heat transfer in equipment and process systems, and evaluating electromagnetic, acoustic, or chemical transport effects that influence overall system performance. In addition, simulation apps created with the Application Builder can be used to share models and make simulation accessible to a broader group of users through custom-built, simplified user interfaces (UIs).
In this session, we will provide an overview of COMSOL Multiphysics by highlighting some real-world user stories spanning different engineering fields as well as major news in version 6.4.
Modeling and simulation is no longer limited to the expertise of a few individuals within an organization. The availability of simulation tools throughout the product or process design workflow — from R&D to the factory floor — allows for a more collaborative and innovative approach to problem solving. Now, even those without prior modeling knowledge can contribute to the process, leveraging the expertise of modeling experts and advanced techniques like digital twins and surrogate models.
To facilitate this collaboration, the Application Builder in the COMSOL Multiphysics® software enables modeling experts to create custom apps with user-friendly interfaces that can be used by scientists and engineers with no modeling experience. Taking it a step further, COMSOL Compiler™ enables organization-wide use of standalone simulation apps without licensing restrictions.
By using the Application Builder and COMSOL Compiler™ together with the COMSOL Multiphysics® platform's built-in Model Builder and Model Manager, engineering organizations can establish an efficient, collaborative, simulation-based environment, supported by the realistic and predictive capabilities of digital twins and surrogate models.
Join this session to learn how the Application Builder and COMSOL Compiler™ can transform your organization's approach to simulation, making advanced tools accessible and fostering a culture of collaborative innovation.
Predicting Loudspeaker Thermal Performance with Multiphysics Simulations
Voice coil heating is the primary cause of power compression in loudspeakers. Predicting voice coil temperature is a challenging problem because of the coupled electromagnetic, mechanical, and thermal interactions present in a loudspeaker driver. In this keynote talk, Laksh Tipparaju will cover the different heat transfer mechanisms in a loudspeaker and discuss how multiphysics simulations can be used to predict the transient thermal behavior and power compression in loudspeakers without the need to build and measure physical samples.
COMSOL Multiphysics® is widely used for the modeling and simulation of electrochemical systems. The software includes specialized modeling features for analyzing a wide range of applications, such as battery design, corrosion and corrosion protection, electrodeposition, water electrolysis, and fuel cells. In addition, generic electrochemistry interfaces provide the flexibility to describe systems with arbitrary electrolyte compositions and custom electrode kinetics.
Join us in this session to learn about the add-on products to COMSOL Multiphysics® for electrochemical modeling: the Battery Design Module, Corrosion Module, Electrodeposition Module, Fuel Cell & Electrolyzer Module, and Electrochemistry Module.
Structural simulation plays an important role in the design of reliable products and structures by enabling the prediction of deformation, stress and strain levels, vibration behavior, and failure risks before building physical prototypes. The COMSOL Multiphysics® software and its add-on Structural Mechanics Module provide an easy-to-use and complete finite element analysis (FEA) environment for modeling the mechanical behavior of solids and structures, including shells and beams, contact and friction, large deformations, and dynamic response.
In this session, we will provide an overview of the structural analysis capabilities in COMSOL Multiphysics®, including static and transient loading, eigenfrequency and frequency response studies, and a range of nonlinear analyses. We will also highlight how built-in multiphysics couplings and specialized add-ons extend these capabilities to advanced material modeling, fatigue and durability evaluation, composites, and rotating machinery.
Connect with other attendees and exchange ideas during this complimentary lunch! Vegan and vegetarian options will be available.
Solver performance becomes increasingly important as physics-based simulation models grow in size and complexity. The COMSOL Multiphysics® software provides a wide selection of solver technologies for stationary and time-dependent problems, nonlinear systems, optimization, and both direct and iterative linear solvers, supporting built-in and user-defined multiphysics couplings for many engineering and scientific applications.
In this session, we will highlight recent solver and performance developments in COMSOL® version 6.4, including support for explicit dynamics formulations for structural analysis, as well as a new NVIDIA CUDA® direct sparse solver (cuDSS) for NVIDIA® GPUs that is generally applicable for any physics. In addition, we will discuss a new mode-following method for parametric eigenfrequency analyses and practical strategies for solving large-scale problems efficiently, including solver selection based on time and memory requirements and the role of hardware factors such as memory bandwidth, processor architecture, and parallelization in overall simulation performance.
The COMSOL Multiphysics® software and the Heat Transfer Module add-on are widely used for thermal analysis in devices and processes. Their simulation capabilities enable users to combine all three modes of heat transfer — conduction, convection, and radiation — and calculate temperature fields and heat fluxes in everything from small-scale components to larger assemblies and built environments.
COMSOL Multiphysics® is designed to capture how thermal effects interact with other physics through multiphysics coupling, enabling realistic studies of conjugate heat transfer and nonisothermal flow; heat generation from various sources, including electromagnetic and chemical effects; and temperature-dependent material behavior.
In this session, we will provide an overview of the functionality in COMSOL Multiphysics® that supports the design, optimization, and validation of thermal management solutions.
The COMSOL Multiphysics® platform provides a comprehensive environment for modeling electromagnetics across a wide frequency range and application space. This includes low-frequency field and electromagnetic interference–electromagnetic compatibility (EMI/EMC) analysis, high-frequency RF and microwave device design, wave optics, ray tracing, and electric discharge phenomena. COMSOL Multiphysics®, along with its add-on modules for electromagnetics, is designed to capture the interaction of electromagnetic fields with other physical effects, including thermal, mechanical, fluid, and material behavior, through multiphysics coupling.
In this session, we will provide an overview of the capabilities for modeling electromagnetics using COMSOL Multiphysics® and highlight how simulation supports the design, optimization, and validation of electromagnetic devices and systems.
Modeling and simulation is essential for understanding and designing systems in which acoustics and vibrations play a central role, such as consumer electronics and vehicles as well as industrial machinery and performance spaces. Using COMSOL Multiphysics® and the Acoustics Module, you can analyze sound propagation, sound insulation, and vibroacoustic behavior, including multiphysics couplings with structural vibrations and electromagnetic forces.
This session will provide an overview of the key acoustics modeling capabilities of COMSOL®, with examples including loudspeaker and transducer design, duct and waveguide acoustics, room acoustics analysis using both wave- and ray-based methods, and thermoviscous effects in microscale geometries.
Panelists
- Stanford University
- DE 24/7
- MathWorks
Multiphysics simulation has evolved from a specialized research tool into a cornerstone of industrial and scientific innovation. This panel brings together experts to discuss the cutting edge of simulation today and the roadmap for the decade ahead.
The conversation will focus on how first-principles, physics-based modeling ensures accuracy and delivers deeper insights. Panelists will share their experiences with the complexities of high-fidelity multiphysics coupling and the growing demand for computational efficiency, including advances enabled by GPU acceleration.
As we speculate on the future, we will discuss the emerging role of simulation apps, digital twins, and AI-driven methods, and how these approaches might complement and extend traditional modeling workflows and solvers.
Join us for this discussion to see how the COMSOL ecosystem continues to redefine the boundaries of what can be modeled, optimized, and built.
To conclude the summit, we will be hosting a cocktail reception with a complimentary bar and hors d'oeuvres. Vegan and vegetarian options will be available.
COMSOL Speakers
VP of Product Management, COMSOL
Bjorn Sjodin is the VP of product management at COMSOL. He has been with COMSOL since 1995 and started out as a member of the development team in Stockholm, Sweden. He joined the COMSOL office in Burlington in 2002.
Principal Applications Engineer, COMSOL
Jinlan Huang is a Principal Applications Engineer at COMSOL Inc., specializing in vibrations and acoustics. She has extensive experience in multiphysics simulation of acoustic systems, integrating structural, fluid, electromagnetic, and thermal effects. She earned her PhD from Boston University, focusing on ultrasound-induced tissue heating and bleeding control, and was a research fellow at Boston Children’s Hospital, where she collaborated with clinicians on 3D real-time ultrasound imaging for beating-heart surgery before joining COMSOL in 2011.
Senior Applications Manager, COMSOL
Andy Cai currently works as a Senior Applications Manager manager leading the structural and acoustics team in the U.S. office. He joined COMSOL in 2015. Previously, he received his PhD in geophysics from Yale University in 2014 and spent a year at the University of Maryland, College Park for postdoctoral work.
Vice President of Sales Strategy, COMSOL
David Kan is COMSOL's Vice President of Sales Strategy. He set up the Los Angeles branch office of COMSOL in 2001 and received a PhD in applied mathematics from UCLA in 1999.
Principal Applications Engineer, COMSOL
Ping Chu is a Principal Applications Engineer specializing in electromagnetics and optics. Prior to joining COMSOL in 2012, Ping received her PhD in condensed matter physics from the University of California, Irvine, investigating the plasmonic and ferromagnetic properties of metallic nanostructures.
Applications Engineer, COMSOL
Prajesh Arvind Jangale is an Applications Engineer on the transport team at COMSOL, specializing in fluid flow, heat transfer, and multiphysics modeling. He supports engineers and researchers in applying COMSOL Multiphysics® to solve complex CFD, thermal, and other transport challenges across industries. Prajesh has a PhD from Texas A&M University in CFD modeling of compressible multiphase flows.
Applications Engineer, COMSOL
Alex King is an applications engineer at COMSOL, specializing in electrochemical systems and processes. He received his PhD in chemical engineering from UC Berkeley and joined COMSOL shortly after in August 2025. During his PhD, Alex used COMSOL to develop multiphysics models of electrolyzers for hydrogen generation and CO2 electroreduction.
Join COMSOL Simulation Summit: Santa Clara
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For registration questions or more information contact info@comsol.com.
Meeting Details
Location
Guest Speakers
Lakshmikanth Tipparaju is a hardware development engineer on the audio hardware technology team at Amazon, where he leads the multiphysics simulation effort for developing audio architectural design for Echo™ devices and Fire TV™ products. He previously worked at Dolby Laboratories and Samsung Research America and has more than 15 years of simulation experience.
David Pappas has been a senior scientist at Rigetti Computing since 2021. Before that, he was the group leader of the Quantum Processing Division at the National Institute of Standards and Technology (NIST) in Boulder, where he worked on both superconducting and ion trap implementations and materials as well as magnetic imaging. He received the Department of Commerce Silver Medal and NIST Bronze Medal for this work. His professional recognitions include being an IEEE Senior Member and American Physical Society (APS) Fellow.
Jennifer (Jen) Dionne is a professor of materials science and, by courtesy, of radiology at Stanford University. She is also a Chan Zuckerberg Biohub Investigator, deputy director of Q-NEXT (a U.S. Department of Energy-funded National Quantum Initiative research center), and cofounder of Pumpkinseed, a company developing high-resolution protein sequencing. Jen received her BS degrees in physics and systems science and mathematics from Washington University in St. Louis, her PhD in applied physics at the California Institute of Technology (Caltech), and her postdoctoral training in chemistry at the University of California, Berkeley.
As a pioneer of classical and quantum nanophotonics, she is passionate about developing methods to detect and direct biochemical transformations, emphasizing critical challenges in global health and sustainability. Her work has been recognized with the Alan T. Waterman Award, a National Institute of Health Director’s New Innovator Award, a Moore Inventor Fellowship, the Materials Research Society Young Investigator Award, and the Presidential Early Career Award for Scientists and Engineers and was featured on Oprah’s list of “50 Things that will make you say 'Wow!'”.
Kenneth Wong is the senior editor of Digital Engineering (DE) 24/7 and the host of the DE Roundtable webcast series. He is always on the quest for breaking news related to design and engineering technologies and regularly writes articles on CAD, finite element analysis, product lifecycle management, additive manufacturing, and augmented and virtual reality.
