Electro-Thermal-Mechanical Workflow and CAD Import
Part 1 of this 5-part course on electro-thermal-mechanical modeling in COMSOL Multiphysics® begins with an introduction to the software through a demonstration of the complete modeling workflow. A model of a chip with an array of bond wires connecting the chip to its substrate is used as an introductory example.
First, we cover how to import the CAD geometry of the chip for this example, which is a COMSOL native CAD file, although there are other options for working with CAD files. Next, we go over how to set up the electrical problem for our model and compute the electric currents through the wire. Then, we build the mesh and upon inspection, remove some geometry features in order to simplify the mesh using virtual operations. Lastly, we compute the model and postprocess the results.
请提交与此页面相关的反馈，或点击此处联系技术支持。