COMSOL Day Leuven
See what is possible with multiphysics modeling
Modeling and simulation is used for innovation across a range of industries, and this COMSOL Day will highlight some of its many applications.
Keynote speakers from leading organizations from Belgium and Luxembourg will present real-world examples of multiphysics modeling in research, development, and product design. COMSOL-led sessions will demonstrate the capabilities of COMSOL Multiphysics® for structural mechanics, electromagnetics, CFD, and coupled multiphysics phenomena such as fluid–structure interaction and electromagnetic heating with thermal expansion. There will also be demonstrations of surrogate modeling based on deep neural networks and integration into digital twins.
Additionally, there will be opportunities at this free 1-day event to ask questions and interact with COMSOL applications engineers and simulation experts in Belgium.
Complimentary lunch, snacks, and refreshments will be included.
Schedule
From the 19th-century hydraulic boat lifts on the Canal du Centre to the first commercially usable lead–acid battery, Belgium and Luxembourg are famous for their engineering achievements and forward thinking. During this session, we will go over how the COMSOL Multiphysics® software and its modeling capabilities can be used to help advance R&D in Belgium and Luxembourg.
Learn the fundamental workflow of COMSOL Multiphysics®. This introductory demonstration will show you all of the key modeling steps, including geometry creation, setting up physics, meshing, solving, and evaluating and visualizing results.
Patrik Kennes, Cochlear Technology Centre Belgium
In this keynote talk, Patrik Kennes will share insights into how Cochlear has leveraged the COMSOL® software in the development of its most innovative hearing implant: the OSI300. This piezoelectric transducer fundamentally differs from traditional electromagnetic bone conduction devices by converting electrical signals directly into precise mechanical vibrations that stimulate the inner ear.
The success of the OSI project demonstrates how computational modeling can accelerate innovation, reduce development costs, and ultimately bring life-changing technology to patients more quickly than traditional development approaches would allow.
This hands-on session is designed for anyone who would like to directly get started with multiphysics modeling. Join us and build your own model from scratch with guidance from a COMSOL engineer. This session is also the perfect opportunity to ask any modeling questions that you may have.
Modeling and simulation is no longer limited to the expertise of a few individuals within an organization. The availability of simulation tools throughout the product or process design workflow — from R&D to the factory floor — allows for a more collaborative and innovative approach to problem solving. Now, even those without prior modeling knowledge can contribute to the process, leveraging the expertise of modeling experts and advanced techniques like digital twins and surrogate models.
To facilitate this collaboration, the Application Builder in the COMSOL Multiphysics® software enables modeling experts to create custom apps with user-friendly interfaces that can be used by scientists and engineers with no modeling experience. Taking it a step further, COMSOL Compiler™ enables organization-wide use of standalone simulation apps without licensing restrictions.
By using the Application Builder and COMSOL Compiler™ together with the COMSOL Multiphysics® platform's built-in Model Builder and Model Manager, engineering organizations can establish an efficient, collaborative, simulation-based environment, supported by the realistic and predictive capabilities of digital twins and surrogate models.
Join this session to learn how the Application Builder and COMSOL Compiler™ can transform your organization's approach to simulation, making advanced tools accessible and fostering a culture of collaborative innovation.
Solver performance becomes increasingly important as physics-based simulation models grow in size and complexity. The COMSOL Multiphysics® software provides a wide selection of solver technologies for stationary and time-dependent problems, nonlinear systems, optimization, and both direct and iterative linear solvers, supporting built-in and user-defined multiphysics couplings for many engineering and scientific applications.
In this session, we will highlight recent solver and performance developments in COMSOL® version 6.4, including support for explicit dynamics formulations for structural analysis, as well as a new NVIDIA CUDA® direct sparse solver (cuDSS) for NVIDIA® GPUs that is generally applicable for any physics. In addition, we will discuss a new mode-following method for parametric eigenfrequency analyses and practical strategies for solving large-scale problems efficiently, including solver selection based on time and memory requirements and the role of hardware factors such as memory bandwidth, processor architecture, and parallelization in overall simulation performance.
In this session, we will demonstrate how to model fluid flow and heat transfer using the CFD Module and the Heat Transfer Module, add-ons to the COMSOL Multiphysics® software. Topics will include laminar and turbulent flow, non-Newtonian fluids, multiphase flow, and flow in microfluidic devices. We will also cover conjugate heat transfer by combining heat transfer in solids and fluids, with optional inclusion of thermal radiation.
These capabilities can be seamlessly extended to multiphysics applications by coupling with structural mechanics for fluid–structure interaction, chemical reactions in reacting flows, and particle tracing.
The COMSOL Multiphysics® platform provides a comprehensive environment for modeling electromagnetics across a wide frequency range and application space. This includes low-frequency field and electromagnetic interference–electromagnetic compatibility (EMI/EMC) analysis, high-frequency RF and microwave device design, wave optics, ray tracing, and electric discharge phenomena. COMSOL Multiphysics®, along with its add-on modules for electromagnetics, is designed to capture the interaction of electromagnetic fields with other physical effects, including thermal, mechanical, fluid, and material behavior, through multiphysics coupling.
This session will provide an overview of the capabilities for modeling electromagnetics using COMSOL Multiphysics® and highlight how simulation supports the design, optimization, and validation of electromagnetic devices and systems.
Structural simulation plays an important role in the design of reliable products and structures by enabling the prediction of deformation, stress and strain levels, vibration behavior, and failure risks before building physical prototypes. The COMSOL Multiphysics® software and its add-on Structural Mechanics Module provide an easy-to-use and complete finite element analysis (FEA) environment for modeling the mechanical behavior of solids and structures, including shells and beams, contact and friction, large deformations, and dynamic response.
In this session, we will provide an overview of the structural analysis capabilities in COMSOL Multiphysics®, including static and transient loading, eigenfrequency and frequency response studies, and a range of nonlinear analyses. We will also highlight how built-in multiphysics couplings and specialized add-ons extend these capabilities to advanced material modeling, fatigue and durability evaluation, composites, and rotating machinery.
Register for COMSOL Day Leuven
To register for the event, please create a new account or log into your existing account.
For registration questions or more information contact info-nl@comsol.com.
COMSOL Day Details
Location
There is a paid indoor parking available near Park Inn by Radisson Leuven.
Keynote Speakers
Alexia Coulon completed her MSc in 2014 at the Institute of Condensed Matter and Nanosciences at the Louvain School of Engineering (EPL) in Belgium. She has been working at Thales Alenia Space since then on high-voltage electronic equipment for space applications.
Her work focuses on the design and validation of insulation technology for high-voltage electronic boards. This involves the selection and validation of materials and processes (printed board materials, potting, etc.), as well as the validation of appropriate insulation design rules.
Patrik Kennes joined the Cochlear Technology Centre Belgium in 2007, where he is currently leading the simulation activities for future implantable hearing solutions. He previously worked as a research engineer at Tenneco Automotive in the field of semiactive electronic suspension systems. Kennes earned an MS and a PhD in bioscience engineering at Katholieke Universiteit, Leuven.
