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How can i model semiconductor and its packaging in Comsol using CAD and test under electrical, mechnical and thermal aspect.
read0 Replies 1133 ViewsRashedul Karim posted 1 decade ago
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0 Replies 770 Views
Rose posted 1 decade ago
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0 Replies 1745 Views
Version 4.1 Structural Mechanics
Yong LI posted 1 decade ago
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7 Replies 5542 Views
Anna Cyganowski posted 2 decades ago reply 1 decade ago by Usman Khan
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1 Replies 4152 Views
Version 4.0a
Ying Peng posted 1 decade ago reply 1 decade ago by Edgar Kaiser
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1 Replies 1944 Views
Version 4.0a
Ashwin Simha posted 1 decade ago reply 1 decade ago by Ivar KJELBERG
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1 Replies 3548 Views
Version 4.1 Fluid & HeatHeat Transfer & Phase ChangeComputational Fluid Dynamics (CFD)Mesh
Ali Masabai posted 1 decade ago reply 1 decade ago by Ivar KJELBERG
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11 Replies 17680 Views
Version 4.0a
Lidia Campa posted 2 decades ago reply 1 decade ago by Ivar KJELBERG
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5 Replies 3103 Views
Alex Lovallo posted 1 decade ago reply 1 decade ago by Ivar KJELBERG
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1 Replies 1301 Views
Everet Anema posted 1 decade ago reply 1 decade ago by Ivar KJELBERG
