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Thermal simulation of packaged circuite

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I need to simulate a packaged optical+electrical circuite which is in a box (filled with N). We want to see the effect of enviromental tempreture change (out of the box) in steady status responce of inner parts. can anyone please let me know how I should define these boundry conditions in heat transfer model ? how should i model the convection of N in the box ? Thank you


0 Replies Last Post 2017年11月8日 GMT-5 10:21
COMSOL Moderator

Hello Maziyar Milanizadeh

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