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Chemical Etching for fixed structure

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Hello everyone, there is a "chemical etching" model in the library and the copper substrate is infinite in the model. http://cn.comsol.com/model/chemical-etching-44481 My question is, when the copper is limited ( with fixed boundaries) and the outer space cannot be etched, how can I simulate the process? This has been bothering me for several weeks. Thank you.



1 Reply Last Post 2018年3月8日 GMT-5 08:34

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Posted: 7 years ago 2018年3月8日 GMT-5 08:34

Commets: 1, Deform Geometry cannot be used here when the copper's structure (etched area) is complex; 2, Level set method is not good, because this method uses Laminar Flow(spf) to control the interface between two face. However, the interface in the etching model should be control by the Transport of Diluted Species(tds). 3, any other suggestion?

Commets: 1, Deform Geometry cannot be used here when the copper's structure (etched area) is complex; 2, Level set method is not good, because this method uses Laminar Flow(spf) to control the interface between two face. However, the interface in the etching model should be control by the Transport of Diluted Species(tds). 3, any other suggestion?

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