Menu

Discussion Forum

New Discussion
查找

Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.

heat flux coefficient setting in Thermal Microactuator model

Posted 2012年11月1日 GMT-4 00:39 0 Replies

Andy Zhang
Send Private Message Flag post as spam

Please login with a confirmed email address before reporting spam

Hello, I have a question in Thermal Microactuator model. (www.comsol.com/showroom/documentation/model/8493/).

Is there a specific reason to set Heat transfer coefficient, upper surface (htc_us) to 0.04[W/(m*K)]/100[um]. Where is this 100 um from? it is something like boundary layer thickness?


Can we set htc_us the same as htc_s, or closer, since it is also close to the ground substrate?



Could you offer some reference on how to set heat flux or convection cooling coefficient for microactuators?



thanks.



0 Replies Last Post 2012年11月1日 GMT-4 00:39
COMSOL Moderator

Hello Andy Zhang

Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.

If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.

Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.

Suggested Content