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Stress during solidification process.
Posted 2015年9月1日 GMT-4 14:29 0 Replies
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Comsol 5.1 application provides many cases about solidification (phase change). It can be used to solve the temperature field, however there is no case on modeling stress during the solidification process. Attached I put one case from COMSOL called tin_melting_front and I am trying to get idea how to solve the stress during the solidification. It seems hard to couple both field directly. In Ansys, there is a way by mapping the temperature into stress every second. Any idea about this would be appreciated. Thanks,
Lin
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Hello maohua lin
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