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Reliable Full-Wave EM Simulation of a Single-Layer SIW Interconnect with Transitions to Microstrip Lines
发布日期 2014
We present a procedure to obtain reliable EM responses for a SIW interconnect with microstrip line transitions. The procedure focuses on two COMSOL® configuration settings: meshing size and simulation bounding box. Once both are properly configured, the implemented structure is tested by perturbing the simulation bounding box to ensure it has no effect on the EM responses.
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- chavezhurtado_presentation.pdf - 1.23MB
- chavezhurtado_paper.pdf - 0.2MB
- chavezhurtado_abstract.pdf - 0.21MB