了解多物理场仿真在基础研究和产品设计中的应用

各个行业的工程师和科研人员都在使用多物理场仿真来研发创新的产品设计和流程。他们在 COMSOL 用户年会上展示了丰富的技术论文和演示文稿,您可以从他们的研究成果中寻找灵感。

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查看 COMSOL 用户年会 2020 论文

2009 - Milanx

Improving the Performance of Hearing Aids Using Acoustic Simulations

Mads Jakob Herring Jensen
Dr., Widex A/S, Denmark

In modern hearing aids, the performance of directional microphone systems is dependent on both the acoustics ... 扩展阅读

Modelling of Melt Cast Cooling and Solidification Processes for Explosives

P. Lamy-Bracq[1] and C. Coulouarn[1]
[1]Nexter Munitions, Tarbes, France

A solidification process of casting explosives in shell is studied in this paper. An enthalpy method approach ... 扩展阅读

Modeling the Rheology of Liquid Detergents

Vincenzo Guida
R&D Process Design Principal Engineer, Procter & Gamble, Italy

Outline of presentation: Comsol is a very flexible platform, ideal to model rheology modification under ... 扩展阅读

Simulation of a Multilayer Thermal Regulator for an Optical Reference

J.A. Ospina[1] and E. Canuto[1]
[1]Politecnico di Torino, Torino, Italy

The research project under which the COMSOL simulations are performed deals with multilayer and fine thermal ... 扩展阅读

Analysis of Infrared Signature of a Ship Operating in MIR and FIR Bands

A. Pellegrini[1], A. Beucci[1], and F. Costa[1]

[1]ALTRAN Italia, Pisa, Italy

In this paper a methodology for calculating the infrared signature of complex objects is presented. The ... 扩展阅读

Phasefield Modeling of Ferroelectric Materials

Marc Kamlah
Head of the Mechanics of Materials Department, Forschungszentrum Karlsruhe, Germany

Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification ... 扩展阅读

COMSOL Multiphysics® Version 4

Svante Littmarck
President and CEO, COMSOL

Svante Littmarck is the CEO of the COMSOL group. He co-founded COMSOL in 1986. He holds a M.Sc. in Applied ... 扩展阅读

Inverse Analysis for Heat Transfer Coefficient Identification

F. Tondini[1], P. Bosetti[1], and S. Bruschi[1]

[1]DIMS, University of Trento, Trento, Italy

The hot stamping of boron steels for producing complex structural components of the car body-in-white is more ... 扩展阅读

Oxidation of Metallic Nanoparticles

A. Auge[1], A. Weddemann[1], F. Wittbracht[1], B. Vogel[1], and A. Hütten[1]

[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott ... 扩展阅读

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single ... 扩展阅读