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各个行业的工程师和科研人员都在使用多物理场仿真来研发创新的产品设计和流程。他们在 COMSOL 用户年会上展示了丰富的技术论文和演示文稿，您可以从他们的研究成果中寻找灵感。
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查看 COMSOL 用户年会 2020 论文
Liquid atomization relies on a variety of forces that disturb the surface of the liquid. In the case of flow ... 扩展阅读
Simulation of arc-wire additive manufacturing is under development in many academic and industrial sectors ... 扩展阅读
The wide bandgap semiconductor silicon carbide (SiC) has drawn increasing attention in recent years as a ... 扩展阅读
Introduction: Mechanical ventilation in the ICU can result in complications, including ventilator-induced ... 扩展阅读
A tablet blister cavity is thermally modelled using the Shell interface in COMSOL® and a response surface ... 扩展阅读
In this paper, the COMSOL Certified Consultant BE CAE & Test shows as the general extrusion operators can ... 扩展阅读
In the medical field the risk assessment of strokes caused by pathological irregularities in the carotid ... 扩展阅读
The COMSOL® app library of the Technical University of Munich is a collection of applications for simulating ... 扩展阅读
Besides the accuracy of the results, the required computation time is an important factor for simulations in ... 扩展阅读
The semiconductor industry is always looking for early anticipation of manufacturing risk, pushing the ... 扩展阅读