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AC/DC Electromagnetics

Investigation of Electromigration in Fine-Pitch Copper Interconnects through Simulation and Analysis

Adrija Chaudhuri¹, Marius van Dijk¹, Johannes Jaeschke ¹, Hermann Oppermann ¹, Martin Schneider-Ramelow ²
¹Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany
²Research Center of Microperipheric Technologies, Technische Universität Berlin, Berlin, Germany

The scaling down of Copper interconnects is an effective approach to increasing the number of signal I/O ... 扩展阅读

Investigation of the Electric Conductivity of an Electrically Heated Reactor

C. Geitner¹
¹Fraunhofer-Institut für Umwelt-, Sicherheits- und Energietechnik UMSICHT, Oberhausen, NRW, Germany

An electrically heated fixed bed (19 mm diameter, 200 mm length) is investigated regarding its electrical ... 扩展阅读

Ionic Neuromodulation and Neurosensing Platform for In Vitro Studies

Jacopo Nicolini¹, Federico Leva¹, Claudio Verardo², Pierpaolo Palestri³, Luca Selmi¹
¹Unimore - Università degli studi di Modena e Reggio Emilia
²Scuola Superiore Sant'Anna
³Università degli studi di Udine

Overview We successfully simulated a template iontronic system for closed-loop neuromodulation and ... 扩展阅读

Modeling of Droplet Charge Dynamics During an Ink Jet Breakup Using COMSOL Multiphysics®

M. Sturma¹, A. Monlon², P. Namy², F. Viry², B. Barbet¹
¹MARKEM-IMAJE, Bourg-lès-Valence (France)
²SIMTEC, Grenoble (France)

Continuous Ink Jet (CIJ) printing technologies are widely used in the field of industrial coding and marking. ... 扩展阅读

Modeling of the Ladle Furnace Preheating with a Graphite Heating Rod

Sergey Semenov¹, Patrick Namy¹, Magnus Sievers², Bernd Friedrich², Veronika Djupvik³, Kjell Blandhol³
¹SIMTEC, Grenoble, France
²IME Process Metallurgy and Metal Recycling, RWTH Aachen University, Aachen, Germany
³Elkem Technology, Kristiansand, Norway

This work, which is done in the framework of the SisAl Pilot EU project, presents the use of the COMSOL ... 扩展阅读

Modeling of Thermal Load and Electric Fields in Microfocus X-Ray Tubes

Dr. Vladimir Burlaka¹, Thorsten Fröba¹
¹X-RAY WorX GmbH, Siemensstraße 26, 30827 Garbsen, Germany

The thermal load on the system components is one of the technical problems in the development of microfocus X ... 扩展阅读

Modeling PCB Based Inductive Position Sensors with the COMSOL® AC/DC Module

Seriem Sid-Ahmed¹, Lorenzo Lugani¹
¹Melexis Technologies SA, Bevaix, Switzerland

The growing adoption of electric vehicles has led to increased exposure of cars to stray magnetic fields. To ... 扩展阅读

Modelling of a Knife-Based Micro-Imager: Resolution and Depth of Investigation

Benjamin Trudgill¹, Ibrahim Alobaidan², Will Carter¹, Dr. David Hu¹, Mark Bacciarelli¹
¹Weatherford International
²Imperial College London

Since the mid-1980s micro-resistivity imagers have provided borehole images using pad-type resistivity ... 扩展阅读

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