了解多物理场仿真在基础研究和产品设计中的应用
各个行业的工程师和科研人员都在使用多物理场仿真来研发创新的产品设计和流程。他们在 COMSOL 用户年会上展示了丰富的技术论文和演示文稿，您可以从他们的研究成果中寻找灵感。
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查看 COMSOL 用户年会 2024 论文
The aim of this study is to evaluate the airflow thermal distribution inside a storehouse in different ... 扩展阅读
The throwing power is an important criterion for the industrial use of an electrolyte in electroplating ... 扩展阅读
To this day seamless accessibility of local or cloud hardware for high performance computing as well as time ... 扩展阅读
The aim of this investigation is to apply computational fluid dynamics simulations to support the design ... 扩展阅读
Over the past million years, several cold ages have occurred and thereby caused perma-frost conditions ... 扩展阅读
In this paper, we present a study of the simulation of Directed Energy Deposition (DED) Additive ... 扩展阅读
While copper remains the dominant material for conduction paths in printed circuit board (PCB) applications, ... 扩展阅读
High power consumption chips have already become a major challenge for modern processors causing low thermal ... 扩展阅读
Technical advancements in miniaturization in the last decades have, among others, brought forth the ... 扩展阅读
This work, which is done in the framework of the SisAl Pilot EU project, presents the use of the COMSOL ... 扩展阅读