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Heat Transfer and Phase Change

COMSOL® Heat Transfer Module and Safe Siting Distances for Burning Propellant

C. Guymon¹
¹Safety Management Services, Inc., West Jordan, UT, USA

Energetic materials that can readily burn are used throughout both private and government industries in ... 扩展阅读

Consequences of Selecting 2D and 3D Geometries for Modeling Thermal Bridges

A.Hayes¹, M.Ghobadi¹, T.Moore¹
¹National Research Council Canada / Conseil national de recherches Canada, Ottawa, Ontario, Canada

COMSOL® has been used to compare 2D and 3D model results to quantify what simplifications can be made when ... 扩展阅读

Thermodynamic Simulation of Hydrogen Chemisorption in Hydride Beds Using External-Internal Cooling

D. G. Faurie¹, A. V. Kolesnikov¹, M. V. Lototskyy²
¹Tshwane University of Technology, Pretoria, South Africa
²University of Western Cape, Cape Town, South Africa

In this study, the proficiency of an external and internally cooled hydride bed was tested. This was ... 扩展阅读

Mathematical and Computational Analysis on Sintering Densification of Binder Jet Printed Valvebody

R. Sun¹, H. Liu¹, H. Zhang¹
¹Purdue University, West Lafayette, IN, USA

Binder jet printing (BJP) is one of the additive manufacturing methods that are being widely implemented as ... 扩展阅读

3D Inspection of AM Components Using CT: From Defect Detection to Thermal Simulation in COMSOL Multiphysics®

K. Genc¹, C. Butler², B. Nye³, B. L. Toralles³, N. Turner³, N. Brierley³, P. Young⁴
¹Synopsys, Inc., Mountain View, CA, USA
²Synopsys NE Ltd, Exeter, United Kingdom
³Manufacturing Technology Centre, Coventry, United Kingdom
⁴University of Exeter, Exeter, United Kingdom

Metal Additive Manufacturing (AM) can be used to create topologically complex designs that would otherwise be ... 扩展阅读

Numerical Modeling of Wire Directed Energy Deposition Additive Manufacturing (Wire-DED) Process

V. Nain¹, M. Carin¹, T. Engel², C. Cordier², D. Boisselier³
¹Univ. Bretagne Sud, IRDL, F-56100 Lorient, France
²INSA, 67000 Strasbourg, France
³IREPA LASER, 67400 Illkirch-Graffenstaden, France

COMSOL Multiphysics® is being utilized to develop Thermal Model for Wire Directed Energy Deposition Additive ... 扩展阅读

Simulation of Electrothermoplasmonic Flow Around an Array of Gold Nanoantennas for Plasmonic Sensing

E. Ruiz-Reina¹, R.A. Rica², J. García³, R. Quidant⁴
¹University of Málaga, Spain
²University of Granada, Spain
³ICFO-Institut de Ciències Fotòniques, Barcelona In
⁴ICREA-Institució Catalana de Recerca i Estudis Ava

Plasmonic-based biosensors have emerged as a powerful, cost effective and portable platform for phatogen and ... 扩展阅读

Modelling of a Dual-Probe Heat-Pulse Soil-Moisture Sensor using COMSOL®

R. N. S.[1], R. Aouti[1], G. Ananthasuresh[1]
[1]Indian Institute of Science, Bangalore, India

Measuring soil moisture content plays an important role not only for sustaining dry farming but also for ... 扩展阅读

Critical Temperature Control of Silicon Micro-Reactors for Lab-On-Chip Applications

S. Paul[1], A. Das[2], A. Bhattacharya[2]
[1]CRNN,University of Calcutta, India
[2]Radio Physics and Electronics, University of Calcutta, India

The development of microfluidic components for implementation of a lab-on-chip system requires both fluid ... 扩展阅读

Electrothermal Study of Cu-CNT Composite TSV Using COMSOL Multiphysics®

K. Sable[1], B. Kumari[2], M. Sahoo[3]
[1]M.Tech Scholar, Indian Institute of Technology Dhanbad., India
[2]SRF, Indian Institute of Technology Dhanbad., India
[3]Assistant Professor, Indian Institute of Technology Dhanbad., India

Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to ... 扩展阅读

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