科技论文和演示页面包括了 COMSOL 全球用户年会上所有的用户演示文稿。这些演示文稿介绍了 COMSOL 用户是如何使用 COMSOL Multiphysics 进行创新性研究和产品设计,研究主题涵盖了包括电气、机械、流体和化工等范围广泛的行业和应用领域。您可以使用“快速搜索”来查找与您研究领域相关的演示文稿。
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A Numerical Investigation on Active Chilled Beams for Indoor Air Conditioning

G. Cammarata, and G. Petrone
Department of Industrial and Mechanical Engineering, University of Catania, Catania, Italy

In this study fluid-dynamical and thermal performance of active chilled beams is investigated by 2D and 3D modelling in COMSOL Multiphysics. Three ...

Use of COMSOL as a Tool in the Design of an Inclined Multiple Borehole Heat Exchanger

E. Johansson[1], J. Acuña[1], B. Palm[1]
[1]Royal Institute of Technology KTH, Stockholm, Sweden

A field of connected boreholes can be used both for cooling, heating and storage purposes. The boreholes transfer heat to or from the ground, which ...

3-Dimensional Blood Cooling Model inside a Carotid Bifurcation

R. Sikorski[1], T. Merrill[1]
[1]Rowan University, Glassboro, NJ, USA

Stroke is caused by an interruption of brain blood supply and is one of the leading causes of death and disability. A mild reduction of 2-5°C in tissue ...

Multiphysics Process Simulation of the Electromagnetic-Supported High Power Laser Beam Welding of Austenitic Stainless Steel

M. Bachmann[1], V. Avilov[1], A. Gumenyuk[1], M. Rethmeier[1]
[1]BAM Federal Institute for Materials Research and Testing, Berlin, Germany

The application of an oscillating magnetic field on the high-power full-penetration laser beam welding process of a 20 mm thick stainless steel plate ...

Heat Transfer Modelling of Single High Temperature Polymer Electrolyte Fuel Cell (HT PEFC) Using COMSOL Multiphysics®

V. Venkataraman[1]
[1]Centre for Hydrogen & Fuel Cell Research, University of Birmingham, United Kingdom

In this paper a 3D geometry of a single HT PEFC with all the components (membrane, cathode, anode & bipolar plate with flow field) was modelled for ...

Thermal Simulation of FCBGA Package with Heat Sink

M. R. Naik[1]
[1]Nitte Meenakshi Institute of Technology, Bengaluru, Karnataka, India

In a modern IC design, the capability of predicting the temperature profile is critically important as well as cooling and related thermal problems are ...

Comparison Between Honeycomb and Fin Heat Exchangers

P. Gateau[1], P. Namy[2], and N. Huc[3]
[1]SAS SYNGAS, rue du camp d’aviation, 44320, Saint Viaud, France, paul.gateau@syngas.eu
[2]SIMTEC, 8 rue Duploye, 38100, Grenoble, patrick.namy@simtecsolution.fr
[3]COMSOL FRANCE, WTC, 38000, Grenoble, nicolas.huc@comsol.fr

Metal honeycombs are used as catalyst supports. They can be considered as complex fins for heat exchange. A simple heat transfer model was compared ...

Modeling Melting Profiles in Chocolate Pieces for Optimizing their Sensory Properties

B. Watzke[1], F. Lenfant[1], N. Martin[1]
[1]Nestlé research Centre, Vers-chez-les-Blanc, Switzerland

Chocolate is a pleasurable product largely consumed over the world. It is known that ingredients, process and particle size distribution largely impact ...

Multiphysics Modeling of a Grain Storage Chamber - new

P. Guha[1], P. Sharma[1], V. Malhotra[1], S. Mishra[1]
[1]CSIR - Central Scientific Instruments Organisation, Chandigarh, India

Proper storage of grains depends on minimizing attacks of insects, fungi, mites, etc. Development of such pests can be controlled by controlling the ...

3-Dimensional Numerical Modeling of Radio Frequency Selective Heating of Insects In Soybeans

S. Wang [1], Z. Huang [1],
[1] Northwest A&F University, Yangling, Shaanxi, China

Radio frequency (RF) heating have potential as alternatives to chemical fumigation for disinfesting legumes. This study was conducted to investigate ...