论文和技术资料

Y. Davletshin[1], J. C. Kumaradas[1]
[1]Ryerson University, Toronto, ON, Canada

A. N. Radwan [1], M. Mehregany [1],
[1] Case Western Reserve University, Cleveland, OH, USA

A. A. Bhat[1], S. Agarwal [1], D. Sujish[1], B. Muralidharan[1], B. P. Reddy[1], G. Padmakumar[1], K. K. Rajan[1]
[1]Indira Gandhi Center for Atomic Research, Kalpakkam, Tamilnadu, India

H. Zhu[1][2], T. Gulati[2], A. K. Datta[2], K. Huang[1]
[1]Institute of Applied Electromagnetics, Sichuan University, Chengdu, China
[2]Department of Biological and Environment Engineering, Cornell University, Ithaca, NY, USA

J. Vélez-Cordero¹, J. D. López Lugo², R. P. Domínguez², J. A. Benítez Martínez², J. H. Cordero², F. M. Sánchez Arévalo^2
1Cátedras Conacyt-Physics Institute, Universidad Autónoma de San Luis Potosí
²Instituto de Investigaciones en Materiales, Universidad Nacional Autónoma de México

S. Wang [1], Z. Huang [1],
[1] Northwest A&F University, Yangling, Shaanxi, China

M.Michatz [1], S. Janson [2], G. Schlick [3], I. Kühne [4], A. Frey [5],
[1] University of Applied Science, Faculty of Mechanical Engineering, Augsburg, Germany; Fraunhofer Research Institution for Casting, Composite and Processing Technology IGCV, Augsburg, Germany
[2] iwb Application Center Augsburg part of the Technical University of Munich (TUM), Augsburg, Germany
[3] Fraunhofer Research Institution for Casting, Composite and Processing Technology IGCV, Augsburg, Germany
[4] Heilbronn University, Faculty of Technology and Economics, Künzelsau, Germany
[5] University of Applied Science, Faculty of Electrical Engineering, Augsburg, Germany

G. Zhang [1], Y. Zhao [1],
[1] Department of Biomedical Engineering, University of Kentucky, Lexington, KY, USA

M.Saberi¹, U.Pelz¹, M.Ghanam¹, T. Bilger¹, A.Jamali¹, E. Bäumker¹, P. Woias¹, F. Goldschmidtböing^1
1Institut für Mikrosystemtechnik (IMTEK), Albert-Ludwigs-Universität Freiburg, Freiburg im Breisgau, Germany

Elise Chevallier¹, Vincent Bruyère¹, Gaëtan Bernard², Patrick Namy^1
1SIMTEC, Grenoble, France
²GFMS