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MEMS and Nanotechnology

Designing Piezoelectric Interdigitated Microactuators using COMSOL

O. Myers [1], M. Anjanappa [2], and C. Freidhoff [3]

[1] Mississippi State University, Mississippi State, MS, USA
[2] University of Maryland Baltimore County, Baltimore, MD, USA
[3] Northrop Grumman Corporation, Electronics Systems Sector, Baltimore, MD, USA

This paper presents a methodology towards designing, analyzing and optimizing piezoelectric interdigitated ... 扩展阅读

Shape, Convection and Convergence

R. Pryor
Pryor Knowledge Systems, Inc., Bloomfield Hills, MI, USA

COMSOL Multiphysics software, when properly configured, can readily solve modeling problems in the laminar ... 扩展阅读

Fluidmechanical Damping Analysis of Resonant Micromirrors with Out-of-plane Comb Drive

T. Klose[1], H. Conrad[2], T. Sandner[1], and H. Schenk[1]

[1]Fraunhofer Institute Photonic Microsystems (FhG-IPMS), Germany
[2]TU Dresden, Semiconductor and Microsystems Technology Laboratory, Germany

Damping is the liminting factor for the reachable maximum deflection. Thus, it is a very important issue for ... 扩展阅读

Micro Cooling of SQUID Sensor

B. Ottosson[1], Y. Jouahri[2], C. Rusu[1], and P. Enoksson[2]
[1]Imego AB, Gothenburg, Sweden
[2]Chalmers University of Technology, Gothenburg, Sweden

The objective of this work has been to realize a feasibility study of a cooling device for a SQUID sensor ... 扩展阅读

Acoustic-Structure Interaction Simulation of a Differential Phase Sensor

J. H. Lee[1]
[1]Department of Mechanical Engineering, American University of Sharjah, Sharjah, UAE

The idea of application as a hearing device based on a parasitoid fly, Ormia ochracea has been studied ... 扩展阅读

Simple Finite Element Model of the Topografiner

H. Cabrera[1], D. A. Zanin[1], L. G. De Pietro[1], A. Vindigni[1], U. Ramsperger[1], D. Pescia[1]
[1]Laboratory for Solid State Physics, ETH Zürich, Zürich, Switzerland

In our recent experiments we are revisiting the topografiner technology for the imaging of surface topography ... 扩展阅读

Heterodimensional Charge-Carrier Confinement in Sub-Monolayer InAs in GaAs

S. Harrison[1], M. Young[1], M. Hayne[1], P. D. Hodgson[1], R. J. Young[1], A. Strittmatter[2], A. Lenz[2], U. W. Pohl[2], D. Bimberg[2]
[1]Department of Physics, Lancaster University, Lancaster, UK
[2]Institut für Festkörperphysik, Berlin, Germany

Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial ... 扩展阅读

Finite Element Analysis of Temperature and Viscosity Effects on Resonances in Thin-Film Bulk Acoustic Wave Resonators

G. Rughoobur[1], M. DeMiguel-Ramos[2], L. García-Gancedo[1], M. Clement[2], J. Olivares[2], T. Mirea[2], W. I. Milne[1], E. Iborra[2], A. J. Flewitt[1]
[1]University of Cambridge, Cambridge, UK
[2]Universidad Politécnica de Madrid, Madrid, Spain

The shear mode of film bulk acoustic resonators (FBARs) is preferred to the longitudinal mode owing to its ... 扩展阅读

Plasmonics of Nano-Gaps

T. Hutter[1], S. Mahajan[2], S. R. Elliott[1]
[1]University of Cambridge, Cambridge, UK
[2]University of Southampton, Southampton, UK

Plasmons, i.e. the collective oscillations of electrons in a metallic nano-structure, lead to strong light ... 扩展阅读

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around ... 扩展阅读

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