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MEMS and Nanotechnology

Modeling and Characterization of Superconducting MEMS for Microwave Applications in Radioastronomy

N. Al Cheikh[1], P. Xavier[1], J. Duchamp[1], and K. Schuster[2]
[1]Institute of Microelectronics, Electromagnetism and Photonics (IMEP-LAHC), Grenoble, France
[2]Institute of Millimetrics Radio Astronomy (IRAM), Grenoble, France

Superconducting GHz electronics circuits are frequently used in Radio Astronomy instrumentation. The features ... 扩展阅读

Simulation of Unidirectional Interdigital Transducers in SAW Devices using COMSOL Multiphysics

D. Pradeep, N. Krishnan, and H. Nemade
Department of Electronics and Communication Engineering, Indian Institute of Technology Guwahati, India

Surface acoustic wave (SAW) devices based on Rayleigh wave, shear wave, love wave, acoustic plate mode (APM) ... 扩展阅读

Designing the Actuator for the Next-Generation Astronomical Deformable Mirrors: a Multidisciplinary and Multiphysics Approach

C. Del Vecchio[1], R. Biasi[2] , D. Gallieni[3], and A. Riccardi[1]

[1]INAF-OAA, Fierenze, Italy
[2]Microgate Srl, Bolzano, Italy
[3]ADS International Srl, Valmadrera, Italy

The actuation system of the deformable mirror is one of the crucial components of an Adaptive Optics unit. ... 扩展阅读

Simulation of the Dynamic Behavior of a Droplet on a Structured Surface using the Non-conservative Level Set Method

N. Boufercha, J. Sägebarth, and H. Sandmaier
Universität Stuttgart / IFF-MST, Stuttgart, Germany

The ongoing trend towards miniaturization, higher integration as well as cost efficiency will make it ... 扩展阅读

Acoustic-Structure Interaction Simulation of a Differential Phase Sensor

J. H. Lee[1]
[1]Department of Mechanical Engineering, American University of Sharjah, Sharjah, UAE

The idea of application as a hearing device based on a parasitoid fly, Ormia ochracea has been studied ... 扩展阅读

Simple Finite Element Model of the Topografiner

H. Cabrera[1], D. A. Zanin[1], L. G. De Pietro[1], A. Vindigni[1], U. Ramsperger[1], D. Pescia[1]
[1]Laboratory for Solid State Physics, ETH Zürich, Zürich, Switzerland

In our recent experiments we are revisiting the topografiner technology for the imaging of surface topography ... 扩展阅读

Heterodimensional Charge-Carrier Confinement in Sub-Monolayer InAs in GaAs

S. Harrison[1], M. Young[1], M. Hayne[1], P. D. Hodgson[1], R. J. Young[1], A. Strittmatter[2], A. Lenz[2], U. W. Pohl[2], D. Bimberg[2]
[1]Department of Physics, Lancaster University, Lancaster, UK
[2]Institut für Festkörperphysik, Berlin, Germany

Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial ... 扩展阅读

Finite Element Analysis of Temperature and Viscosity Effects on Resonances in Thin-Film Bulk Acoustic Wave Resonators

G. Rughoobur[1], M. DeMiguel-Ramos[2], L. García-Gancedo[1], M. Clement[2], J. Olivares[2], T. Mirea[2], W. I. Milne[1], E. Iborra[2], A. J. Flewitt[1]
[1]University of Cambridge, Cambridge, UK
[2]Universidad Politécnica de Madrid, Madrid, Spain

The shear mode of film bulk acoustic resonators (FBARs) is preferred to the longitudinal mode owing to its ... 扩展阅读

Plasmonics of Nano-Gaps

T. Hutter[1], S. Mahajan[2], S. R. Elliott[1]
[1]University of Cambridge, Cambridge, UK
[2]University of Southampton, Southampton, UK

Plasmons, i.e. the collective oscillations of electrons in a metallic nano-structure, lead to strong light ... 扩展阅读

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around ... 扩展阅读

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