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Air Damping of Oscillating MEMS Structures: Modeling and Comparison with Experiment

S. Gorelick[1], M. Leivo[1], U. Kantojärvi[1]
[1]VTT Technical Research Centre of Finland, Espoo, Finland

Excessive air damping can be detrimental to the performance of oscillating MEMS components. Complex systems, ... 扩展阅读

Modeling and Simulation of Damping Resistance of a Cantilever Based Energy Harvester

M. I. Hassan [1], A. Brimmo [1], A. N. Chatterjee [2],
[1] Masdar Institute of Science and Technology, Abu Dhabi, UAE
[2] MEMS Department, GLOBALFOUNDRIES, Singapore, Singapore

The multilayer composite single mass cantilever is a MEMS energy harvester structure. The vibrating structure ... 扩展阅读

Modeling the Acoustic Scattering from Objects Buried in Porous Sediment Using COMSOL Multiphysics® Software

A. Bonomo [1], M. Isakson [1],
[1] Applied Research Laboratories, The University of Texas at Austin, Austin, TX, USA

A frequency-domain finite element (FE) technique for computing the acoustic scattering from axially symmetric ... 扩展阅读

Numerical Analysis of the Flow Structure in the Continuous Casting Two-strand Tundish

M. Warzecha [1], J. Jowsa [1], A. M. Hutny [1], P. Warzecha [1], T. Merder [2]
[1] Czestochowa University of Technology, Czestochowa, Poland
[2] Silesian University of Technology, Katowice, Poland

Calculations were carried out for the water model of the investigated tundish, represented on a scale 1:3. ... 扩展阅读

Numerical Analysis of Conjugate Heat Transfer in Foams

N. Bianco[1], R. Capuano[1], W.K.S. Chiu[2], S. Cunsolo[1], V. Naso[1], M. Oliviero[1]
[1]DETEC, Università degli Studi Federico II, Napoli, Italy
[2]Department of Mechanical Engineering, University of Connecticut, Storrs, CT, USA

A conjugate conductive-convective-radiative discrete model useful for the study and the simulation of heat ... 扩展阅读

Influência da Camada de Ar Sobre a Deformação de uma Embalagem de Líquido com Cartão Tipo LPB

I. Neitzel[1], K. B. Matos[1], L. R. Pesch[1]
[1]Faculdade de Telêmaco Borba - FATEB, Telêmaco Borba, Paraná, Brasil

As embalagens de produtos alimentícios são hoje em dia predominantemente feitas com cartão tipo LPB (Liquid ... 扩展阅读

FSI for Coolant Flow in Research-type Nuclear Reactors

F. Curtis[1], K. Ekici[1], and J. Freels[2]
[1]University of Tennessee, Knoxville, TN
[2]Oak Ridge National Lab, Oak Ridge, TN

The High Flux Isotope Reactor, located at the Oak Ridge National Laboratory, is scheduled to undergo a ... 扩展阅读

Acoustical Design of Stethoscope for Improved Performance

C. Thiagarajan[1], Gururajan R.[2], A. H. Baig[2], Prema S.[3]
[1]ATOA Scientific Technologies Pvt Ltd, Whitefield, Bangalore, Karnataka India
[2]University of Southern Queensland, Toowoomba Qld 4350, Australia.
[3]RMK Engineering College, Chennai, Tamil Nadu, India

Stethoscope is in use for more than 200 years for medical diagnostics, especially for auscultation. Recently, ... 扩展阅读

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around ... 扩展阅读

Shear Induced Detachment Of Microorganisms Attached To A Plane Wall

B. Boulbène, J. Morchain, and P. Schmitz
Université de Toulouse, NSA, UPS, INP, LISBP, Toulouse, France

We present numerical results involving microorganisms adhering to a plane surface submitted to a shear flow. ... 扩展阅读

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