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了解多物理场仿真在基础研究和产品设计中的应用

各个行业的工程师和科研人员都在使用多物理场仿真来研发创新的产品设计和流程。他们在 COMSOL 用户年会上展示了丰富的技术论文和演示文稿，您可以从他们的研究成果中寻找灵感。

使用左侧【快速搜索】工具查找您感兴趣的研究，或按照应用领域进行筛选。

查看 COMSOL 用户年会 2025 论文

The Influence of Foam Materials on the FR Performance of Ear Cushion Experiment and Simulation 新

高若晗¹, 林丽¹
¹大北欧通讯设备（中国）有限公司，厦门

Foam, as the internal filling material for headphone ear cushion, has a significant influence on user ... 扩展阅读

Thermo-Optic Response of Coupled Silicon Photonic Crystal Cavities under Packaging Airflow 新

Yixuan Chen¹, Xingyue Tong¹
¹Nanophotonics Research Centre, Institute of Microscale Optoelectronics & State Key Laboratory of Radio Frequency Heterogeneous Integration, Shenzhen University, Shenzhen 518060, China.

Silicon photonic devices feature a high degree of integration and strong optical field confinement. However, ... 扩展阅读

Topology-Optimized Battery Cold Plate Design Based on COMSOL and MATLAB 新

Ze Sun¹, Panchun Tang¹
¹East China University of Science and Technology, Shanghai 200237, China

The risk of thermal runaway highlights the critical need for efficient liquid cooling in lithium-ion ... 扩展阅读

Ultra-narrowband hot-electron photodetection with Friedrich-Wintgen bound states in the continuum 新

WeiJia Shao ¹, Qiuyi Long¹
¹School of Physical Science and Technology & University Engineering Research Center of Advanced Functional Materials and Intelligent Sensing, Guangxi Normal University, China

Efficient operations of hot-electron photodetectors (HE PDs) require strong energy deposition in metals ... 扩展阅读

Uncertainty Quantification of Bonding Wave Velocity in Direct Wafer Bonding 新

Sichen Liang¹, Zhiheng Huang¹, Hui Yan², Qizhuo Li², Yang Liu³
¹School of Materials Science and Engineering, Sun Yat-sen University, Guangzhou, China
²School of Computer Science and Engineering, Sun Yat-sen University, Guangzhou, China
³School of Electronics and Information Technology, Sun Yat-sen University, Guangzhou, China

Direct wafer bonding is a key process for advanced 3D integration, in which the propagation of the bonding ... 扩展阅读

Vibro-Acoustic Modelling, Structural Optimization, and Experimental Validation of a Bicycle Speaker 新

Sukvasant Tantikovit¹, Tim Whitwell¹
¹Tectonic Audio Labs

While personal audio devices are popular among cyclists, conventional earbuds attenuate ambient traffic ... 扩展阅读

XR 眼镜夹持力仿真的可行性研究和因素分析新

马建¹, 张哲¹
¹上海龙旗智能科技有限公司

随着扩展现实（XR）技术的快速发展，XR 眼镜作为可穿戴设备的重要形态，其佩戴舒适性日益成为影响用户体验和产品竞争力的关键因素。夹持力作为镜腿与头部相互挤压产生的作用力，直接关系到佩戴的稳定性与舒适性；通常来说 ... 扩展阅读

一种检测样品内部贋磁场以及电场效应的 Ramsey 装置新

黄增航¹
¹中国科学院高能物理研究所东莞分部

本研究提供一种检测样品内部贋磁场以及电场效应的Ramsey装置，该装置涉及均匀主磁场、射频突变磁场、射频放大单元、10-20KV高压源、铜电极以及PFA样品等。在研究的初期通过Comsol进行了电磁模块的搭建 ... 扩展阅读

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