论文和技术资料

A. Klishin[1], M. J. Demkowicz[1]
[1]Massachusetts Institute of Technology, Cambridge, MA, USA

Md Aslam Ansari [1], Dr. Sanjeev Kumar [1],
[1] Indian Institute of Science, Bangalore, Karnataka, India

O. Myers [1], M. Anjanappa [2], and C. Freidhoff [3]

[1] Mississippi State University, Mississippi State, MS, USA
[2] University of Maryland Baltimore County, Baltimore, MD, USA
[3] Northrop Grumman Corporation, Electronics Systems Sector, Baltimore, MD, USA

M. Al-Rawashdeh[1,2], V. Hessel[1,2], P. Löb[1], and F. Schönfeld[1]
[1]Institut für Mikrotechnik Mainz GmbH, Mainz, Germany
[2]Department of Chemical Engineering and
Chemistry, Eindhoven University of Technology, Eindhoven, Netherlands

L. Spicci [1],
[1] Everywave srl, Italy

K. Y. Gandomi¹, Z. Zhao¹, P. A. Carvalho¹, C. J. Nycz¹, G. S. Fischer¹, E. C. Burdette^2
1Worcester Polytechnic Institute, Worcester, MA
²Acoustic Medsystems Inc., Savoy, IL, USA

V U Thomas¹, M A Yar¹, S Mehraban¹, J C T Cullen¹, S G R Brown¹, N P Lavery^1
1Swansea University, UK

吴淑莲 [1], 李晖 [2], 李志芳 [2],
[1] 福建师范大学，福州，中国
[2] 福建师范大学，福州，中国

Cs. Ö. Boros [1], Sz. Beleznai [1], P. Koppa [1], Z. Fekete [2], Á. Cs. Horváth [3]
[1] Department of Atomic Physics, Budapest University of Technology and Economics, Budapest, Hungary
[2] MTA EK NAP B Research Group for Implantable Microsystems, Budapest, Hungary
[3] Óbuda University Doctoral School of Material Science & Technology, Budapest, Hungary

甘政涛 [1],
[1] 中国科学院力学研究所，北京，中国