论文和技术资料

M. Olsson [1]
[1] COMSOL AB, Stockholm, Sweden

L. Tong[1]
[1]Keisoku Engineering System Co., Ltd., Japan

A. Kyrgiazoglou [1], T. Theodoulidis [1],
[1] Department of Mechanical Engineering, University of Western Macedonia, Kozani, Greece

S. C. Hegde [1], S. Agrawal [1], A. Sangeetha [1],
[1] VIT University, Vellore, India

M. Usoltceva [1], K. Crombé [4], E. Faudot [3], S. Heuraux [3], R. D’Inca [2], J. Jacquot [2], J-M. Noterdaeme [5], R. Ochoukov [2]
[1] Department of Applied Physics, Ghent University, Belgium; Max-Planck-Institut für Plasmaphysik, Garching, Germany; Université de Lorraine, Nancy, France
[2] Max-Planck-Institut für Plasmaphysik, Garching, Germany
[3] Université de Lorraine, Nancy, France
[4] Department of Applied Physics, Ghent University, Ghent, Belgium; LPP-ERM-KMS, TEC partner, Brussels, Belgium
[5] Department of Applied Physics, Ghent University, Belgium; Max-Planck-Institut für Plasmaphysik, Garching, Germany

K. Carlson¹, J. Arle¹, T. Dreeben², N. Paudel³, S. Dokos⁴, J. A. Tuszynski⁵, E. Federov⁶, Z. Bomzon^6
1Harvard Medical School/Beth Israel Deaconess Medical Center, Boston, MA, USA
²Osram Opto Semiconductors, Exeter, NH, USA
³IEEE, Greenville, NC, USA
⁴University of New South Wales, Sydney, NSW, Australia
⁵University of Alberta, Edmonton, AB, Canada
⁶Novocure Ltd., Haifa, Israel

Mina Mortazavi¹, L. Amato¹, N. Manivannan², W. Balachandran^1
1Electronics and computer engineering, Brunel University London, United Kingdom
²Design Department, Brunel University London, United Kingdom

Michaël DUMONT¹, Roland ERNST^2
1EMDPI - JAM consulting, Grenoble, France
²Grenoble Alpes University, SIMAP, St Martin d'Hères, France

A. Leggieri [1], D. Passi [1], F. Di Paolo [1], G. Saggio [1]
[1] University of Rome, Rome, Italy

P. Karn[1], S. Mishra[1]
[1]Bhabha Atomic Research Centre, Trombay, Mumbai, India