了解多物理场仿真在基础研究和产品设计中的应用

各个行业的工程师和科研人员都在使用多物理场仿真来研发创新的产品设计和流程。他们在 COMSOL 用户年会上展示了丰富的技术论文和演示文稿,您可以从他们的研究成果中寻找灵感。

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Simulation of a Forming Process for Joining a Piezo Aluminium Module

M. Hackert, S.F. Jahn, and A. Schubert
Chemnitz University of Technology, Chair Micromanufacturing Technology, Germany

The fabrication of piezo aluminium composite modules for sensor and actor applications with mass production ... 扩展阅读

Simulation of the Mechanical Stability of Inkjet-Printed Hierarchical Microsieves

S.F. Jahn[1,3], S. Ebert[2], M. Hackert[1], W.A. Goedel[2], R.R. Baumann[3], and A. Schubert[1,4]
[1]Chemnitz University of Technology, Chair Micromanufacturing Technology, Germany
[2]Chemnitz University of Technology, Physical Chemistry, Germany
[3]Chemnitz University of Technology, Professorship for Digital Printing and Imaging, Germany
[4]Fraunhofer Institute for Machine Tools and Forming Technology, Chemnitz, Germany

Porous membranes with pore sizes in the micrometer scale are required in many micro systems dedicated to ... 扩展阅读

Simulation of a Modular Die Stamp for Micro Impact Extrusion

A. Schubert[1][2], R. Pohl[1], and M. Hackert[1]
[1]Chair Micromanufacturing Technology, Faculty of Mechanical Engineering, Chemnitz University of Technology, Chemnitz, Germany
[2]Fraunhofer Institute for Machine Tools and Forming Technology, Chemnitz, Germany

Micro impact extrusion is investigated at Chemnitz University of Technology as a potential procedure for ... 扩展阅读

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