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Heat and Mass Transfer in Reactive Multilayer Systems (RMS)

M. Rühl[1], G. Dietrich[2], E. Pflug[1], S. Braun[2], A. Leson[2]
[1]TU Dresden, Laser and Surface Technology, Dresden, Germany
[2]IWS Dresden, Fraunhofer Institute for Material and Beam Technology, Dresden, Germany

Established joining techniques like welding, soldering or brazing typically are characterized by a large ... 扩展阅读

Pseudo-3D Multiphysics Simulation of a Hydride Vapor Phase Epitaxy Reactor

M. Hackert-Oschätzchen[1], M. Penzel[1], P. Plänitz[2], A. Schubert[1][3]
[1]Chemnitz University of Technology, Chemnitz, Germany
[2]GWT-TUD, Dresden, Germany
[3]Fraunhofer Institute for Machine Tools and Forming Technology IWU, Chemnitz, Germany

Gallium nitride (GaN) and its related nitride alloys with special physical properties are in technical areas ... 扩展阅读

Deformation of Stamp Features with Slanted Walls During Microcontact Printing

F. E. Hizir[1], H. M. Al-Qahtani[1, 2], D. E. Hardt[1]
[1]Massachusetts Institute of Technology, Cambridge, MA, USA
[2]King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia

Microcontact printing is a method for depositing patterns of thin films or molecular monolayers on surfaces ... 扩展阅读

Simulation of Droplet Impingement on a Solid Surface by the Level Set Method

J. Hu[1], R. Jia[1], K. Wan[2], X. Xiong[3]
[1]Department of Mechanical Engineering, University of Bridgeport, Bridgeport, CT, USA
[2]Mechanical and Industrial Engineering, Northeastern University, Boston, MA, USA
[3]Department of Electrical Engineering, University of Bridgeport, Bridgeport, CT, USA

The dynamic behavior of droplet impingement on a solid surface is important to many engineering applications. ... 扩展阅读

Electromagnetic Release Process for Flexible Electronics

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device ... 扩展阅读

Demonstration of All-Optical NAND Logic Gate Using Photonic Integrated Circuits

J. T. Andrews[1], R. Choubey[1], O P Choudhary[1], N. Malviya[1], A. Patel[1], M. Kumar[1], S. Chouksey[1], J. Solanki[1]
[1]National MEMS Design Center, Department of Applied Physics, Shri G S Institute of Technology & Science, Indore 452003 MP, India

A logic gate performs a certain Boolean logic operation on one or more logical inputs and produces a single ... 扩展阅读

Engineering Light Photonics, Plasmonics and Meta-materials

Dr. A. Prabhakar
Dept. of Electrical Engineering, IIT-Madras, Chennai, Tamil Nadu, India

Anil Prabhakar joined the faculty at IIT-Madras in 2002, after 5 years of post-doctoral experience in the ... 扩展阅读

COMSOL Multiphysics in Plasmonics and Metamaterials

S. Sun [1,2], and G. Guo [2,3]
[1]Physics Division, National Center for Theoretical Sciences (North), National Taiwan University, Taipei 10617, Taiwan
[2]Department of Physics, National Taiwan University, Taipei 10617, Taiwan
[3]Graduate Institute of Applied Physics, National Chengchi University, Taipei 11605, Taiwan

This paper will present research about: * Effective-medium properties of metamaterials: A quasi-mode theory * ... 扩展阅读

Tunable Metamaterial-Inspired Resonators for Optimal Wireless Power Transfer Schemes

A. X. Lalas [1], N. V. Kantartzis [2], T. T. Zygiridis [3], T. P. Theodoulidis [4],
[1] Information Technologies Institute, Centre of Research & Technology - Hellas, 6th km Harilaou - Thermi, Thessaloniki, Greece
[2] Department of Electrical and Computer Engineering, Aristotle University of Thessaloniki, Thessaloniki, Greece
[3] Department of Informatics and Telecommunications Engineering, University of Western Macedonia, Kozani, Greece
[4] Department of Mechanical Engineering, University of Western Macedonia, Kozani, Greece

The advent of wireless power transfer (WPT) technology has offered a gradually evolving research field with a ... 扩展阅读

Numerical Prediction of Weld Bead Geometry in Plasma Arc Welding of Titanium Sheets

V. Dhinakaran[1], S. Khope[1], N. S. Shanmugam[1] , K. Sankaranarayanasamy[1]
[1]National Institute of Technology, Tiruchirappalli, Tiruchirappalli, Tamil Nadu, India

Plasma Arc Welding (PAW) is one of the important arc welding processes commonly used in electronics, medical, ... 扩展阅读

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