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Simulation of Quench Behaviour of the 11 T Superconducting Dipole for HL-LHC

M. Mentink [1], B. Auchmann [1], L. Bortot [1], M. Maciejewski [1], Marco Prioli [1], E. Ravaioli [1], E. Stubberud [1], A. Verweij [1],
[1] CERN, Switzerland

As part of the High Luminosity Large Hadron Collider a number of magnets is to be installed for the purpose ... 扩展阅读

Designing Polymer Thick Film Intracranial Electrodes for use in Intra-Operative MRI Setting.

G. Bonmassar[1], and A. Golby[2]
[1]AA. Martinos Center, Massachusetts General Hospital, Charlestown, Massachusetts, USA
[2]Department of Neurosurgery, Brigham and Women’s Hospital, Boston, Massachusetts, USA

A new type of MRI compatible intracranial electrode based on Polymer Thick Film (PTF) is presented and ... 扩展阅读

Time Domain Reflectometry of a Water Tree inside an Underground Cable

K. Burkes [1],
[1] Savannah River National Laboratory, Jackson, SC, USA

This poster presents the electric field flowing through an insulated cable due to a high frequency voltage ... 扩展阅读

Rapid Prototyping of Biosensing Surface Plasmon Resonance Devices using COMSOL & Matlab software

J.J. Dubowski[1], and D.Carrier[1]
[1]Department of Electrical and Computer Engineering, Université de Sherbrooke, Quebec, Canada

We present a Finite Element Method simulation procedure that allows rapid development of prototype devices ... 扩展阅读

Experimental Observation and Numerical Prediction of Induction Heating in a Graphite Test Article

T.A. Jankowski[1], D.P. Johnson[1], J.D. Jurney[1], J.E. Freer[1], L.M. Dougherty[1], and S.A. Stout[1]

[1]Los Alamos National Laboratory, Los Alamos, New Mexico, USA

The induction heating coils used in the plutonium casting furnaces at the Los Alamos National Laboratory are ... 扩展阅读

Bioheat Dissipation of a Implantable Brain-Machine Interface

J. M. Herrera Morales [1],
[1] Wyss Center for Bio and Neuroengineering, Switzerland

Brain-Machine Interfaces (BMI) provide a direct communication link between brain and external devices such as ... 扩展阅读

Modeling of High-Speed PCB-Interconnects, Vias and Connectors for the Estimation of SI-Losses

A. K. Palit [1],
[1] ZF-Lemförder Electronic GmbH (ZF-Friedrichshafen AG. Group), Germany

Estimation of both single-ended (SE) and differential-pair (DP) impedances of high-speed PCB-traces ... 扩展阅读

Laser-Material Interaction Modeling using the COMSOL Multiphysics® software

E. C. Chevallier [1], V. Bruyère [1], P. Namy [1],
[1] SIMTEC, Grenoble, France

Surface engineering is a key technology used in a wide range of sectors in industry. Among other techniques, ... 扩展阅读

Investigating a Tensor Formulation to describe the Magnetic Structure of Soft Magnetic Materials

O. Maloberti [1], M. Nesser [2], E. Salloum [2], J. Fortin [2], S. Panier [2], P. Dassonvalle [1], C. Pineau [3], M. Caruso [4], J-P. Birat [3], I. Tolleneer [4],
[1] ESIEE Amiens, France
[2] UPJV-LTI, France
[3] IRT-M2P, France
[4] CRM Group, France

Most of existing material representations [1], even including the dynamic hysteresis and iron losses [2], ... 扩展阅读

Modeling Microwave Heating During Batch Processing of a Liquid Sample in a Single Mode Cavity

S. Curet [1], F. Bellicanta Begnini [1], O. Rouaud [1], L. Boillereaux [1]
[1] L’UNAM Université, ONIRIS, CNRS, GEPEA, Nantes, France

The use of microwaves for heating purposes of dielectric materials is encountered in many industrial ... 扩展阅读

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