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各个行业的工程师和科研人员都在使用多物理场仿真来研发创新的产品设计和流程。他们在 COMSOL 用户年会上展示了丰富的技术论文和演示文稿,您可以从他们的研究成果中寻找灵感。
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查看 COMSOL 用户年会 2024 论文
Advances in 3D display technology relies heavily on the birefringence of light as it propagates through ... 扩展阅读
High-power couplers (both coaxial and ridge waveguide type) at UHF frequencies are presently under ... 扩展阅读
We designed AlGaAs all-dielectric nanoantennas with magnetic dipole resonance at near-infrared wavelengths. ... 扩展阅读
近年来,三维系统级封装技术逐渐成为人们的关注焦点,是下一代集成电路封装设计最有发展潜力的实现方案。然而,热管理是系统级封装技术需解决的关键问题。图1是典型的系统级封装结构,包含堆叠芯片、硅通孔、封装基板 ... 扩展阅读
The attempt has taken to miniaturized size of non contact temperature sensor by using ultrasonic trans ... 扩展阅读
Microwave impedance microscopy (MIM) is a novel mode of atomic force microscopy that can measure topography ... 扩展阅读
Simplistic, 1D analytical calculations in electro-magneto-hydrodynamics are attractive to technologists and ... 扩展阅读
According to the National Health and Nutrition Examination Survey data, 35 % of US adults aged 40 years and ... 扩展阅读
Plasma reactors can be applied to the conversion of waste, biomass and fuels to synthesis gas (mixture of ... 扩展阅读
The main purpose of a drive unit is to transform the electrical signal at its terminals into acoustic waves ... 扩展阅读