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查看 COMSOL 用户年会 2024 论文
近年来,三维系统级封装技术逐渐成为人们的关注焦点,是下一代集成电路封装设计最有发展潜力的实现方案。然而,热管理是系统级封装技术需解决的关键问题。图1是典型的系统级封装结构,包含堆叠芯片、硅通孔、封装基板 ... 扩展阅读
Accurate thermo-physical properties of materials are valuable for both scientific research and industrial ... 扩展阅读
The radiation force effects on the surface displacement can be calculated by solving the Navier-Stokes ... 扩展阅读
The growing demand for efficient transmission (1), including refurbishing of existing lines, requires ... 扩展阅读
Vibration and music therapies are non-invasive treatments having effective results although their basics are ... 扩展阅读
In this work, we investigate the resonant properties of finite-sized membrane-mass-type elastic metamaterial ... 扩展阅读
A computer controlled microwave exposure system and specialized applicators were constructed for the purpose ... 扩展阅读
In-service detection of fatigue cracking in metallic aerospace structures relies on capable and efficient ... 扩展阅读
Magnetic nanoparticles have diverse applications ranging from contamination control to medical diagnosis and ... 扩展阅读
Electric Arc Furnaces (EAF) use graphite electrodes to strike an arc to melt scrap steel, recycling it for ... 扩展阅读