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查看 COMSOL 用户年会 2025 论文
In recent years the thermal behavior of electric machines is an attractive research topic. Due to the ... 扩展阅读
The problem under investigation is electrical scale-up of a generic metallurgical process for primary metal ... 扩展阅读
近年来,三维系统级封装技术逐渐成为人们的关注焦点,是下一代集成电路封装设计最有发展潜力的实现方案。然而,热管理是系统级封装技术需解决的关键问题。图1是典型的系统级封装结构,包含堆叠芯片、硅通孔、封装基板 ... 扩展阅读
A pulsed Eddy Current (EC) probe, using the transient response to a stepped voltage is being developed for in ... 扩展阅读
Of utmost importance in appliance design and manufacture are the features for protection from fire and for ... 扩展阅读
We show that COMSOL Multiphysics® software can efficiently simulate the diffusion equation (DE) in diffusive ... 扩展阅读
Magnetic nanoparticles have diverse applications ranging from contamination control to medical diagnosis and ... 扩展阅读
Electric Arc Furnaces (EAF) use graphite electrodes to strike an arc to melt scrap steel, recycling it for ... 扩展阅读
This paper deals with the simulation and analysis of SAR and temperature distribution induced by a Planar ... 扩展阅读
There is urgent need to monitor dental and oral diseases, such as tooth decay, gum diseases, and teeth ... 扩展阅读
