论文和技术资料

F. Qi [1], J. Men [1], L. Yang [1], Z. Bing [1] , J. Yang [1], F. He [2], L. Pan [2], Z. Shao [2], G. Gao [2], X. Zhang [3], H. Wei [3], S. Duo [3], L. Song [3], X. Wang [3], Z. Wang [3], G. Wei [3], Y. Li [3], H. Yang [3], Z. Ma [3], B. Li [3], Y. Zhang [3], Y. Li [3], Y. Xie [3], D. Yu [3]
[1] FZB Technology, Inc., Plymouth, MI, USA
[2] Shenzhen South Dare Auto Parts, Ltd., Shenzhen, China
[3] Fuxin Dare Auto Parts, Ltd., Fuxin, China

M. Antczak, P. Idziak, and W. Lyskawiski
Poznań University of Technology, Poland

Yun Lai [1], Jinjie Shi [2],
[1] National Laboratory of Solid State Microstructures, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, Jiangsu, People’s Republic of China
[2] College of Physics, Optoelectronics and Energy & Collaborative Innovation Center of Suzhou Nano Science and Technology, Soochow University, Suzhou 215006, Jiangsu, People’s Republic of China

A. Leggieri[1], F. Di Paolo[1], D. Passi[1]
[1]Univeristy of Rome "Tor Vergata" - Department of Electronic Engineering, Rome, Italy

B. A. Marmo [1], M. P. Snaith [1],
[1] Xi Engineering Consultants, Edinburgh, United Kingdom

A. Shoory, A. Smorgonskiy, and F. Vega
Electromagnetic Compatibility (EMC) group, Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland

R.W. Pryor[1]
[1]Pryor Knowledge Systems, Bloomfield Hills, MI, USA

I. Lupelli[1], P. Gaudio[1], A. Malizia[1], R. Quaranta[1]
[1]Department of Industrial Engineering, University of Rome “Tor Vergata”, Roma, Italy

K. Singh, N. Kothari, and S. Choudhary
Electronics and Communication Engineering Department
Geetanjali Institute of Technical Studies
Dabok, Udaipur
Rajasthan, India

张春 [1], 朱铧丞 [1], Ashim Datta [1],
[1] 四川大学，成都，四川，中国