Samuel Hartmann, ABB Semiconductors, Switzerland
ABB 半导体借助多物理场仿真延长了绝缘栅双极型晶体管(IGBT)的寿命。IGBT 模块广泛应用于大功率电气系统,长期耐受电、热及机械疲劳。ABB 团队探索了多种键合线与发射极的焊接方式,并借此研究了新型针脚焊接技术能否延长器件寿命。同时,他们还采用全新的焊接技术,在芯片发射极和铝键合线之间增加了应力缓冲层。借助数值仿真,研究人员对导致 IGBT 模块组件性能下降的原因进行了分析,并揭示了改进后的 IGBT 芯片耐用性大幅提升的物理原理。
Loading PDF...
Suggested Stories
Simulation-Led Strategy for Corrosion Prevention
Corrosion is a widespread concern costing ...
Simulation Turns Up the Heat and Energy Efficiency at Whirlpool Corporation
Engineers working on a joint research ...
On the Cutting Edge of Hearing Aid Research
Nearly 20% of the United States population ...
Simulation App Introduces Personalized Oncology Care
iBMB, a spin-off of the University of ...
