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时长： 41:23
时长： 1:14:00
COMSOL® 多物理场仿真在半导体键合工艺中的应用
随着芯片集成度不断提高，倒装键合、混合键合等各种键合工艺，普遍面临残余应力、界面失效、翘曲变形等诸多挑战。多物理场仿真技术能够对键合工艺中涉及的电磁 ...
时长： 1:17:17
时长： 19:13
Keynote: Modeling Low-Temperature Superconducting Devices in COMSOL Multiphysics®
In this keynote talk from the COMSOL Conference 2024 Boston, Anil Erol of ...
时长： 44:39
时长： 51:59
时长： 22:35
Keynote: Sustain On-Demand Product Innovation and Process Development in an Operation-Oriented Environment
In this keynote talk from the COMSOL Conference 2024 Florence, Marco ...
时长： 24:19
Keynote: Electroacoustics and FEA: A Long and Successful Relationship
In the world of electroacoustics, finite element analysis (FEA) has been ...
时长： 58:37
时长： 24:49
Multiphysics Modeling for the Aerospace & Defense Industry
In the aerospace & defense industry, it is vital for engineers to ...
时长： 23:43
Keynote: Modeling Electrochemical Energy-Conversion Technologies
In this keynote talk from the COMSOL Conference 2024 Boston, Adam Z. Weber ...
时长： 44:45
Modeling Semiconductor Packaging in COMSOL Multiphysics®
Semiconductor packaging is a critical step in the development of modern ...
时长： 38:31
Modeling Multibody Dynamics with COMSOL Multiphysics®
Multibody dynamics modeling plays a vital role in the development of ...
时长： 52:44
时长： 1:12:56
时长： 1:14:00
COMSOL® 多物理场仿真在半导体键合工艺中的应用
随着芯片集成度不断提高，倒装键合、混合键合等各种键合工艺，普遍面临残余应力、界面失效、翘曲变形等诸多挑战。多物理场仿真技术能够对键合工艺中涉及的电磁 ...
时长： 1:17:17
时长： 19:13
Keynote: Modeling Low-Temperature Superconducting Devices in COMSOL Multiphysics®
In this keynote talk from the COMSOL Conference 2024 Boston, Anil Erol of ...
时长： 22:35
Keynote: Sustain On-Demand Product Innovation and Process Development in an Operation-Oriented Environment
In this keynote talk from the COMSOL Conference 2024 Florence, Marco ...
时长： 24:19
Keynote: Electroacoustics and FEA: A Long and Successful Relationship
In the world of electroacoustics, finite element analysis (FEA) has been ...
时长： 24:49
Multiphysics Modeling for the Aerospace & Defense Industry
In the aerospace & defense industry, it is vital for engineers to deliver ...
时长： 23:43
Keynote: Modeling Electrochemical Energy-Conversion Technologies
In this keynote talk from the COMSOL Conference 2024 Boston, Adam Z. Weber ...
时长： 44:45
Modeling Semiconductor Packaging in COMSOL Multiphysics®
Semiconductor packaging is a critical step in the development of modern ...
时长： 38:31
Modeling Multibody Dynamics with COMSOL Multiphysics®
Multibody dynamics modeling plays a vital role in the development of ...
时长： 52:44
时长： 1:12:56
时长： 1:14:00
COMSOL® 多物理场仿真在半导体键合工艺中的应用
随着芯片集成度不断提高，倒装键合、混合键合等各种键合工艺，普遍面临残余应力、界面失效、翘曲变形等诸多挑战。多物理场仿真技术能够对键合工艺中涉及的电磁 ...
时长： 1:17:17
时长： 19:13
Keynote: Modeling Low-Temperature Superconducting Devices in COMSOL Multiphysics®
In this keynote talk from the COMSOL Conference 2024 Boston, Anil Erol of ...
时长： 22:35
Keynote: Sustain On-Demand Product Innovation and Process Development in an Operation-Oriented Environment
In this keynote talk from the COMSOL Conference 2024 Florence, Marco ...
时长： 24:19
Keynote: Electroacoustics and FEA: A Long and Successful Relationship
In the world of electroacoustics, finite element analysis (FEA) has been ...
时长： 24:49
Multiphysics Modeling for the Aerospace & Defense Industry
In the aerospace & defense industry, it is vital for engineers to deliver ...
时长： 23:43
Keynote: Modeling Electrochemical Energy-Conversion Technologies
In this keynote talk from the COMSOL Conference 2024 Boston, Adam Z. Weber ...
时长： 44:45
Modeling Semiconductor Packaging in COMSOL Multiphysics®
Semiconductor packaging is a critical step in the development of modern ...
时长： 38:31
Modeling Multibody Dynamics with COMSOL Multiphysics®
Multibody dynamics modeling plays a vital role in the development of ...
时长： 52:44
时长： 1:12:56
